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Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
October 22, 2024 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), October 27-30, 2024, in Fort Lauderdale, Florida. IEEE BCICTS will bring together leaders from across the semiconductor industry to discuss and demonstrate the latest advances in integrated circuit technology for applications across automotive, wireless, and aerospace sectors.
At IEEE BCICTS, StratEdge will highlight its robust lineup of thermally-enhanced ceramic and molded semiconductor packages. Engineered to support critical applications from DC to 63+ GHz, these packages provide ultra-low-loss performance, dissipate heat efficiently, and deliver high-frequency reliability essential for today’s high-demand devices. With a broad selection of open-tooled designs available, StratEdge's packaging solutions support seamless integration and optimize performance across various mounting configurations. Of particular interest shown in the accompanying photograph is LL6845-10-3, a Leaded Laminate (LL) series package that was designed specifically for GaAs and GaNa devices operating from 26.5-31 GHz.
"IEEE BCICTS is an invaluable forum for connecting with industry innovators who understand the importance of packaging that meets the exacting demands of high-frequency, high-power applications," emphasized Casey Krawiec, VP of Global Sales at StratEdge. "Our expertise in thermal management and high-frequency transmission line design, combined with our state-of-the-art Assembly Services, enables us to offer complete packaging solutions that enhance device performance and reliability. By leveraging our advanced wire bonding and die attach systems in a certified cleanroom environment, customers gain significant advantages in quality and efficiency."
IEEE BCICTS 2024 attendees are invited to visit StratEdge's exhibit, connect with their team of packaging experts, and learn how StratEdge can meet specific high-frequency packaging needs.
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Klaus Koziol - atgSuggested Items
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Global Electronics Association Releases Fall Schedule of Instructor-led Courses
10/20/2025 | Corey Lynn, Global Electronics AssociationWhether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.