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Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
October 22, 2024 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), October 27-30, 2024, in Fort Lauderdale, Florida. IEEE BCICTS will bring together leaders from across the semiconductor industry to discuss and demonstrate the latest advances in integrated circuit technology for applications across automotive, wireless, and aerospace sectors.
At IEEE BCICTS, StratEdge will highlight its robust lineup of thermally-enhanced ceramic and molded semiconductor packages. Engineered to support critical applications from DC to 63+ GHz, these packages provide ultra-low-loss performance, dissipate heat efficiently, and deliver high-frequency reliability essential for today’s high-demand devices. With a broad selection of open-tooled designs available, StratEdge's packaging solutions support seamless integration and optimize performance across various mounting configurations. Of particular interest shown in the accompanying photograph is LL6845-10-3, a Leaded Laminate (LL) series package that was designed specifically for GaAs and GaNa devices operating from 26.5-31 GHz.
"IEEE BCICTS is an invaluable forum for connecting with industry innovators who understand the importance of packaging that meets the exacting demands of high-frequency, high-power applications," emphasized Casey Krawiec, VP of Global Sales at StratEdge. "Our expertise in thermal management and high-frequency transmission line design, combined with our state-of-the-art Assembly Services, enables us to offer complete packaging solutions that enhance device performance and reliability. By leveraging our advanced wire bonding and die attach systems in a certified cleanroom environment, customers gain significant advantages in quality and efficiency."
IEEE BCICTS 2024 attendees are invited to visit StratEdge's exhibit, connect with their team of packaging experts, and learn how StratEdge can meet specific high-frequency packaging needs.
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Julia McCaffrey - NCAB GroupSuggested Items
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs:
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
Koh Young Hosts First Technical Review Meeting at New Taiwan Office to Showcase Advanced Metrology and Inspection Solutions
09/01/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is inviting semiconductor and SMT professionals to its first Technical Review Meeting at the newly opened Koh Young Taiwan (KYTW) office in Zhubei City.
Amkor Technology Issues Statement Regarding City of Peoria Land Acquisition
08/28/2025 | Amkor TechnologyAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced the City of Peoria, Arizona successfully bid as part of a State Land Auction to acquire 834.5 acres for future development.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.