The New Chapter: The Benefits of Continuing Education
It’s Only Common Sense: You’ve Got to Hustle
The IPC Hall of Fame and Its Namesake
October 23, 2024 | Dan Feinberg, I-Connect007Estimated reading time: 1 minute
Editor’s note: This is the first in a series of articles about members of the IPC Hall of Fame.
IPC has been advancing our industry since the organization was founded more than 60 years ago, but it could not have been done without the volunteer efforts of so many members. Each year, some of those members are recognized for their significant contributions through awards such as the Rising Star Award, the Dieter Bergman Fellowship Award, the President's Award, and the Corporate Recognition Award.
As you would expect, those who are honored with these awards continue making valuable contributions that benefit the industry, and they receive even higher levels of recognition from IPC in the following years. Eventually, a select few are recognized with the highest level of recognition the organization offers: the Raymond E. Pritchard Hall of Fame Award (HOF). According to IPC, it is presented to “individuals in recognition of the highest level of achievement, extraordinary contributions, and distinguished service to IPC and to the advancement of the industry, including the creation of a spirit of mutual esteem, respect, and recognition among members consistent with the goals and mission of IPC on a long-term basis.”
The award’s namesake is Ray Pritchard, who was hired as executive director by the six printed circuit board companies that founded IPC in 1957. In recognition of Ray’s enduring contributions to IPC and the industry, this award commemorates him and is offered as the highest honor an industry member can receive. The HOF is awarded most years and sometimes to more than one individual. The first Hall of Fame Award was presented in 1977 to William McGinley of Methode Electronics. Since then, 45 individuals, including Ray Pritchard in 1982, have been presented with the award.
To read this entire article, which appeared in the October 2024 issue of PCB007 Magazine, click here.
Share on:
Suggested Items
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”