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One Partial HDI Technique: mSAP 

11/05/2024 | Andy Shaughnessy, Design007 Magazine
Chris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.

Polymatech, ECM Group Forge Strategic Joint Venture for Semiconductor Wafer Fabrication in Grenoble, France

09/12/2024 | PRNewswire
Polymatech, a multinational corporation (MNC), a leading player in semiconductor manufacturing with a strong presence in India and global business operations in USA, Singapore, Bahrain, UK and UAE announced the signing of a Memorandum of Understanding (MoU) with ECM Group, a globally recognised leader in advanced microelectronics and semiconductor technologies to establish a Joint Venture Company in Grenoble, France.

Polymatech Electronics Acquires Nisene Technology Group, California to Revolutionize Semiconductor Industry

08/07/2024 | PRNewswire
In a strategic move to bolster its position in cutting-edge semiconductor chip fabrication and testing devices, Polymatech Electronics, India's first semiconductor chip maker, has officially announced its acquisition of Nisene Technology Group Inc., California, USA, a company with a 50-year history in the semiconductor industry. The acquisition was executed through Polymatech's wholly-owned subsidiary, Artificial Electronics Intelligent Materials Pte Ltd. in Singapore.

Cadence Partners with Antiviral Discovery Consortium to Spearhead Rapid Development of Treatments for Viral Pandemics

12/08/2023 | Cadence Design Systems, Inc.
Cadence Molecular Sciences (OpenEye)—a business unit of Cadence Design Systems—will provide OpenEye’s molecular design software to power the open-science AI-driven Structure-enabled Antiviral Platform (ASAP) Discovery Consortium in support of an innovative effort to rapidly develop antivirals to prevent future pandemics.

UHDI Fundamentals: Talking UHDI with John Johnson, Part 1

11/21/2023 | Steve Williams, The Right Approach Consulting LLC
American Standard Circuits is an early adopter of Averatek’s A-SAP process for its ultra-high definition interconnect (UHDI) products. I sat down with industry veteran John Johnson to discuss this. John, vice president of business development, oversees quality at American Standard Circuits, and previously worked at Averatek. In the spirit of full disclosure, we will be discussing and sharing photos, slides, and materials with permission from both ASC and Averatek. This is the first of a three-part interview. 
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