Renesas Collaborates with Intel on Best-in-Class Power Management Solution for New Intel Core Ultra 200V Series Processors
October 24, 2024 | RenesasEstimated reading time: 1 minute
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel® Core™ Ultra 200V series.
Collaborating closely with Intel, Renesas has developed an innovative new customized power management IC (PMIC) that covers the entire power management needs for this newest generation of Intel processors. This advanced and highly integrated PMIC, combined with a pre-regulator and a battery charger, offers a complete solution for PCs leveraging the new Intel processor. The three new devices work together to provide a purpose-built power solution targeted at client laptops, particularly those running AI applications that tend to consume a lot of power.
Feature Set Optimized for Mobile Applications
The new devices include the RAA225019 PMIC, the RAA489301 high-efficiency pre-regulator, and the ISL9241 battery charger. These devices have a feature set optimized for low-power mobile computing applications. Renesas solutions are backed by tested reference designs and strong application support.
The RAA225019 PMIC is highly configurable for Lunar Lake applications and features fully integrated power MOSFETs and current sensing circuitry. It supports high switching frequencies, making it well suited for small form factor applications without compromising efficiency.
The RAA489301 pre-regulator is a 3-level buck converter designed to provide an optimized voltage range for the RAA225019 PMIC. Its innovative architecture enhances thermal performance compared to traditional 2-level buck designs, and it supports a wide input and output voltage range. This allows for superior efficiency in compact, high-power-density applications, making it an ideal choice for demanding power solutions.
“With the launch of the newest Intel Core Ultra processors, we are committed to delivering the best battery life experience possible for our customers,” said Josh Newman, Vice President, Client Computing Group and General Manager, Product and Platform Marketing at Intel. “Together with Renesas, we enabled a solution that will bring the next generation of innovative mobile platforms with unrivaled power efficiency.”
"Our mutual commitment with Intel to AI-powered mobile solutions benefits every user with leading-edge technology,” said Tom Truman, Vice President and General Manager, Performance Computing Power at Renesas. “This offering demonstrates the depth and breadth of our power technology and highlights our ability to stay ahead of emerging market trends.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.
Hitachi Unveils $1B U.S. Investment in Critical Grid Infrastructure
09/05/2025 | Hitachi EnergyHitachi Energy, a wholly owned subsidiary of Hitachi, Ltd., and global leader in electrification, today announced a historic investment of more than $1 billion USD to expand the production of critical electrical grid infrastructure in the United States.
Wisdom From Data-center Power Pioneer Mike Mosman
09/02/2025 | Barry Matties, I-Connect007Few engineers have moved the levers of modern electronics more decisively than Mike Mosman. From the pre-email computer rooms of the 1980s to today’s hyperscale campuses cranking out AI cycles, the retired power engineer and co-founder of CCG Facilities Integration has spent four decades proving that uptime is a design discipline, not a hope.
Connect the Dots: How to Avoid Five Common Causes of Board Failure
09/04/2025 | Matt Stevenson -- Column: Connect the DotsBoards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.