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iNEMI HDI Socket Warpage Prediction and Characterization Webinar

11/15/2024 | iNEMI
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.

American Standard Circuits to Exhibit at the 2024 Annual Symposium of The Association of Old Crows

11/19/2024 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits/ASC Sunstone announced that his company will be exhibiting at the Annual Conference and Symposium of the Association of Old Crows to be held December 11 through the 13 in National Harbor, Maryland.

Boeing Delivers Advanced O3b mPOWER Satellites to Operator SES

11/14/2024 | Boeing
Boeing teams have successfully delivered the 7th and 8th O3b mPOWER satellites to SES. These satellites, featuring Boeing’s advanced software-defined communications payload, are being transported to Cape Canaveral for a planned launch in December.

Bloom Energy, Quanta Computer Expand Partnership to Power AI Revolution

11/11/2024 | BUSINESS WIRE
Bloom Energy, a world leader in solid oxide fuel cell (SOFC) technology, and Quanta Computer Inc., a premier Taiwanese electronics manufacturer, announced a major expansion of an existing agreement to power the production of critical hardware serving the AI industry. The new agreement increases the power capacity of Quanta’s existing Bloom SOFC installation by more than 150 percent and will circumvent a costly utility interconnection delay to keep up with rapidly growing demand for orders.

One Partial HDI Technique: mSAP 

11/05/2024 | Andy Shaughnessy, Design007 Magazine
Chris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
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