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Real Time with... SMTAI 2024: Summit Interconnect Doing Its Part to Rebuild Industry Expertise

10/29/2024 | Real Time with...SMTAI
In this interview from the recent SMTAI show, Nolan Johnson speaks with Jesse Vaughan from Summit Interconnect.  Jesse hits the highlights for some of Summit's programs to promote skilled workers in our industry—programs such as apprenticeships, Emerging Engineers, and more.

iNEMI Connector Footprint Tolerance End-of-Project Webinar

10/24/2024 | iNEMI
iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints.

New Information Now Available for Popular Podcast Series on PCB Design

10/24/2024 | I-Connect007
Exciting news for listeners of On the Line With... PCB 3.0: A New Design Methodology, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from Cadence's subject matter experts is now available for download.

Designers Notebook: Implementing HDI and UHDI Circuit Board Technology

10/23/2024 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.

Cicor Recognized as a "Hidden Champion" in Swiss Media Reputation Study

10/23/2024 | Cicor
The Cicor Group has been honored with the first-place award in the "Hidden Champions" category of a recent Swiss media reputation study.
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