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Suggested Items

New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection

10/22/2025 | I-Connect007
In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.

Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication

10/15/2025 | I-Connect007
I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.

I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series

10/10/2025 | I-Connect007
In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.

New Podcast Episode: How Does UHDI Benefit SWaP?

10/03/2025 | I-Connect007
In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.

New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!

09/29/2025 | I-Connect007
The final episode of the On the Line with… Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.
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