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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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Würth Elektronik Expands Its FPC Connector Family
October 30, 2024 | Würth ElektronikEstimated reading time: Less than a minute
The selection of connectors for flat flexible cables (FFC) and flexible printed circuits (FPC) from Würth Elektronik is getting even larger. The manufacturer of electronic and electromechanical components now offers WR-FPC ZIF connectors (Zero Insertion Force) with locking mechanism, and featuring gold-plated contacts. Gold over nickel on the connector strip improves electrical conductivity, wear resistance, corrosion resistance, and reliability. The new variant is primarily aimed at connecting flexible printed circuits.
The mechanical properties and polarity of the gold-plated connectors are identical to the standard series with tin plating, so no design changes are required if a customer wishes to upgrade. In addition to improved conductivity and signal quality, the FPC connectors offer another advantage: FPCs usually have gold-plated contacts. The new connectors avoid mixing gold and tin in the transition zone. Gold and tin form an electrochemical series, which can cause corrosion and limit the service life of the connection. It is therefore recommended to ensure that gold is combined with gold and tin with tin on the contact surfaces.
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L3Harris Expands Indiana Facility to Support America’s Golden Dome
04/18/2025 | L3Harris TechnologiesL3Harris Technologies has completed a $125 million expansion at its space manufacturing facility in Fort Wayne to support the Department of Defense’s urgent need for on-orbit technology to defend the homeland by building a “Golden Dome” around the United States.
Observations on Palladium as a Final Finish
04/04/2025 | Happy Holden, I-Connect007Not much has been published about palladium as a final finish, but it’s experiencing a renaissance as a liquid metal for metallization of copper in ultra HDI and as a final finish. It was very popular in the 1970s because of its corrosion resistance, as the only other final finishes were tin-lead reflow, Ni/Au, OSP, or immersion tin. Palladium was very popular with the automotive industry then and Photocircuits of Glen Cove, New York, was a major supplier of boards.
Uyemura Announces Six Sigma Graduates
04/02/2025 | UyemuraDr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.
Gold as a Key Component in PCBs and IC Substrates
03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' AtotechGold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.
SAMI-AEC Earns Gold Membership Under “Made in Saudi” Program
03/19/2025 | SAMISAMI Advanced Electronics Company (SAMI-AEC) proudly announces its elevation to the prestigious Gold Category within the “Made in Saudi” program.