-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Würth Elektronik Expands Its FPC Connector Family
October 30, 2024 | Würth ElektronikEstimated reading time: Less than a minute
The selection of connectors for flat flexible cables (FFC) and flexible printed circuits (FPC) from Würth Elektronik is getting even larger. The manufacturer of electronic and electromechanical components now offers WR-FPC ZIF connectors (Zero Insertion Force) with locking mechanism, and featuring gold-plated contacts. Gold over nickel on the connector strip improves electrical conductivity, wear resistance, corrosion resistance, and reliability. The new variant is primarily aimed at connecting flexible printed circuits.
The mechanical properties and polarity of the gold-plated connectors are identical to the standard series with tin plating, so no design changes are required if a customer wishes to upgrade. In addition to improved conductivity and signal quality, the FPC connectors offer another advantage: FPCs usually have gold-plated contacts. The new connectors avoid mixing gold and tin in the transition zone. Gold and tin form an electrochemical series, which can cause corrosion and limit the service life of the connection. It is therefore recommended to ensure that gold is combined with gold and tin with tin on the contact surfaces.
Suggested Items
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
Electroninks Acquires Complete UTDots Advanced Materials Nanoinks Portfolio and IP
05/19/2025 | ElectroninksElectroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications.
SAMI-AEC Earns Gold Membership Under 'Made in Saudi' Program
05/19/2025 | SAMI-AECSAMI Advanced Electronics Company (SAMI-AEC) proudly announces its elevation to the prestigious Gold Category within the “Made in Saudi” program.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
Panel Driver IC Price Decline Slows in 1H25; Gold Prices, China Subsidies, and U.S.-China Tariffs Emerge as Key Variables
04/28/2025 | TrendForceTrendForce’s latest investigation finds that China’s subsidy policies and rising concerns over reciprocal tariffs are reshaping brand strategies in the panel market, indirectly influencing price trends for panel driver ICs.