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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Würth Elektronik Expands Its FPC Connector Family
October 30, 2024 | Würth ElektronikEstimated reading time: Less than a minute
The selection of connectors for flat flexible cables (FFC) and flexible printed circuits (FPC) from Würth Elektronik is getting even larger. The manufacturer of electronic and electromechanical components now offers WR-FPC ZIF connectors (Zero Insertion Force) with locking mechanism, and featuring gold-plated contacts. Gold over nickel on the connector strip improves electrical conductivity, wear resistance, corrosion resistance, and reliability. The new variant is primarily aimed at connecting flexible printed circuits.
The mechanical properties and polarity of the gold-plated connectors are identical to the standard series with tin plating, so no design changes are required if a customer wishes to upgrade. In addition to improved conductivity and signal quality, the FPC connectors offer another advantage: FPCs usually have gold-plated contacts. The new connectors avoid mixing gold and tin in the transition zone. Gold and tin form an electrochemical series, which can cause corrosion and limit the service life of the connection. It is therefore recommended to ensure that gold is combined with gold and tin with tin on the contact surfaces.
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Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies
10/24/2024 | Rich DePoto, UyemuraIn this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.
Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone
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Royal Mint Launches Gold Recovery Factory from E-Waste
08/08/2024 | Royal MintA pioneering new factory that provides a more sustainable source of gold and reduces reliance on mining has been unveiled by The Royal Mint.
Rocket Lab Completes Integration and Testing of Twin Spacecraft for NASA Mars Mission
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Automatic Paste Transfer and Quick Change Squeegee for ASMPT Printers
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