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DuPont, Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End PCB Technology Development
October 30, 2024 | DuPontEstimated reading time: 2 minutes
DuPont and Zhen Ding Technology Group announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology. The signing ceremony, held yesterday at the Shenzhen Avary Time Center, was attended by Charles Shen, Chairman, Zhen Ding; Yi Zhang, President of the Asia Pacific Region, DuPont; and Thean Ming Tan, Global Business Director for Laminates, DuPont.
Through this strategic partnership, DuPont and Zhen Ding will work to enhance end-user applications, advance cutting-edge research and development, improve material performance, and promote the sustainable development of the electronics sector. Furthermore, they intend to deepen their cooperation in advancing smart manufacturing, corporate governance, and sustainability initiatives.
"As a leader in the global PCB industry, Zhen Ding possesses significant technical expertise and is open to collaborations that drive industry development,” said Yi Zhang, President, DuPont Asia Pacific Region. “DuPont is honored to partner with the best in the field to enhance customer service and unlock new innovative possibilities for the global electronics sector."
DuPont is an industry leader in advanced interconnects and thermal management, providing solutions for chip fabrication, packaging, PCBs, and assembly. These solutions are critical for fostering breakthrough innovations vital for advanced computing and artificial intelligence. DuPont is committed to being the partner of choice for its customers, addressing the evolving demands in sectors such as advanced packaging, high-end substrates, AI applications, automotive electronics, high-frequency communications, and data centers. Through materials innovation, DuPont delivers superior quality solutions that empower customers to succeed both now and in the future.
“As a global leader in the electronic materials industry, DuPont possesses robust R&D, reliable quality, manufacturing capabilities, and a stable global supply chain. These are core competencies that Zhen Ding highly values,” said Charles Shen, Chairman, Zhen Ding Group. “In this partnership, both parties will integrate their respective resources, collaboratively explore growth opportunities, and exert a positive influence on the industry. Through comprehensive cooperation in the development of new materials and key technologies, we aim to address the industry's demand for the complex performance of advanced PCBs and foster future innovations.”
DuPont and Zhen Ding Technology Group sign strategic cooperation agreement to advance high-end printed circuit board technology development. Yi Zhang, President of the Asia Pacific Region, DuPont (Left), and Charles Shen, Chairman, Zhen Ding (Right), signed the agreement on behalf of the company.
DuPont and Zhen Ding Technology Group sign strategic cooperation agreement to advance high-end printed circuit board technology development. D.J. Lee, Chief Operation Officer, Zhen Ding (Left 1), Yi Zhang, President of the Asia Pacific Region, DuPont (Left 2), Charles Shen, Chairman, Zhen Ding (Right 2), and Thean Ming Tan, Global Business Director for Laminates, DuPont (Right 1) attended the signing ceremony
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