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KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop

01/22/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview.

Top 5 Global Robotics Trends 2025

01/22/2025 | IFR
The global market value of industrial robot installations has reached an all-time high of US$ 16.5 billion. Future demand will be driven by a number of technological innovations, market forces and new fields of business. The International Federation of Robotics reports on the top 5 trends for the robotics industry for 2025:

Taiwan Earthquake Shows Shows Minimal Impact on Wafer Fabs, But Tightness in the TV Panel Supply May Worsen in 1Q25

01/21/2025 | TrendForce
A magnitude 6.4 earthquake struck southern Taiwan, with its epicenter in Chiayi, at 12:17 AM on January 21, 2025. TrendForce’s preliminary assessment found that nearby wafer fabs had not suffered significant damage.

SMT Perspectives and Prospects: Artificial Intelligence, Part 4—Prompt Engineering

01/22/2025 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
The introduction of Generative AI models and ChatGPT-4’s rise to fame has brought about a relatively new term: prompt engineering. What is prompt engineering and what its impact? What prompt engineering techniques, tools, and platforms can optimize the use of Generative AI models, particularly large language models (LLMs)? What tips, pointers, and best practices can be used to hone prompt engineering? The following column addresses these questions.

Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.
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