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Don Cantow Appointed as General Manager of Altium

01/02/2026 | Altium
Altium, a global leader in electronics design systems, announced the appointment of Don Cantow as General Manager of Altium, effective January 1, 2026.

Happy New Year from the I-Connect007 Staff

12/31/2025 | Michelle Te, I-Connect007
The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.

Is Material Handling the Last Frontier of Automation?

12/30/2025 | Nolan Johnson, SMT007 Magazine
In this conversation with David Ly, technical sales manager at Inovaxe, the spotlight lands on one of EMS manufacturing’s most overlooked bottlenecks: material handling. While factories invest heavily in line automation, David argues that true efficiency gains come from automating the transactional data and traceability behind every reel—not just moving parts around. From image-driven receiving to pick-to-light smart racks, he demonstrates how EMS companies can reduce labor, eliminate errors, and achieve near-continuous uptime—often with ROI measured in months, not years.

Why AI/ML May Be the Next Big Step for PCB Fabs

12/23/2025 | Sydney Xiao, Global Electronics Association East Asia
PCB manufacturing is approaching a pivotal moment across the global electronics supply chain. For decades, the industry grew by adding equipment, expanding capacity, and relying on the accumulated experience of seasoned engineers. Today, the landscape is shaped by rising product complexity, increasingly sensitive material systems, tighter delivery expectations, and a worldwide shortage of technical talent. The traditional model is nearing its limits.

Connect the Dots: The Future of Designing for Reality—Outer Layer Imaging

12/24/2025 | Matt Stevenson -- Column: Connect the Dots
If you read my column regularly, you know I’m passionate about helping designers get the most from their designs. In my November column, I focused on designer best practices for the electroless copper component of the manufacturing process. The next step is outer layer imaging: the transition from digital to physical, and where the designer’s IP meets the board.
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