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Murata’s Revolutionary Stretchable Printed Circuit Elevates Wearable Medical Devices Printed Circuit Products
October 31, 2024 | MurataEstimated reading time: 2 minutes
Murata Manufacturing Co., Ltd reveals an innovative new Stretchable Printed Circuit (SPC) technology marking a significant development in printed circuit technology. Murata's SPC represents the next advancement in substrate development, providing both flexibility and the capability to stretch and deform while maintaining full functionality. It is perfect for creating advanced medical products, like wearable therapeutic devices and vital monitoring tools, that can provide better accuracy, durability, and patient comfort than today’s equivalent devices.
In recent years, in the medical field, to make more accurate diagnoses, the importance of sophisticated tests performed in hospitals and biometric information collected continuously in daily life has increased. Daily vital sign monitoring is important to prevent lifestyle-related diseases, therefore wearable medical devices are now ubiquitous. However, existing devices are often too stiff for many applications, creating issues like patient discomfort, poor surface contact, or unstable data acquisition. Murata's SPC excels in its inherent flexibility, stretchability, and ability to adapt, supporting multi-sensing functionalities to address diverse user requirements. The material is incredibly soft and gentle on the skin, making it ideal for medical and wellness devices like EEG (Electroencephalogram), EMG (Electromyogram), and ECG(Electrocardiogram). Its stretchable nature can enable a single device to accommodate various body areas and patients of different sizes, as well as allowing more easily for continuous monitoring applications or monitoring in previously challenging areas such as elbows or knee joints.
Engineered with cutting-edge capabilities, including printing stretchable electrodes compliant with ANSI/AAMI EC12 standards, SPC paves the way for next-generation medical devices. It achieves seamless integration and optimal performance through innovative telescopic component mounting and hybrid bonding technology between substrates. By effectively blocking electromagnetic noise, the unique shield layer offers reliable protection for the signal path. Additionally, the substrate construction demonstrates excellent reliability, with high resistance to moisture and the ability to withstand high voltages for long durations, while allowing for more flexibility in component mounting, giving designers more freedom to innovate.
Murata's SPC can be tailored to meet individual customer specifications with the help of Murata’s extensive range of resources to facilitate collaborative product development. This can be harnessed by product designers, enabling them to optimize their designs. Murata can further support development by conducting tests in various conditions and resolving failure modes by identifying their root causes. Depending on the required specifications, filters, amplifiers, and multiple sensors can be mounted on a single sheet, enabling accurate data acquisition and sensing of several items. With this solution, Murata performs custom design, prototyping and verification, and mass production based on the required specifications.
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Rachael Temple - AlltematedSuggested Items
Don Cantow Appointed as General Manager of Altium
01/02/2026 | AltiumAltium, a global leader in electronics design systems, announced the appointment of Don Cantow as General Manager of Altium, effective January 1, 2026.
Happy New Year from the I-Connect007 Staff
12/31/2025 | Michelle Te, I-Connect007The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.
Is Material Handling the Last Frontier of Automation?
12/30/2025 | Nolan Johnson, SMT007 MagazineIn this conversation with David Ly, technical sales manager at Inovaxe, the spotlight lands on one of EMS manufacturing’s most overlooked bottlenecks: material handling. While factories invest heavily in line automation, David argues that true efficiency gains come from automating the transactional data and traceability behind every reel—not just moving parts around. From image-driven receiving to pick-to-light smart racks, he demonstrates how EMS companies can reduce labor, eliminate errors, and achieve near-continuous uptime—often with ROI measured in months, not years.
Why AI/ML May Be the Next Big Step for PCB Fabs
12/23/2025 | Sydney Xiao, Global Electronics Association East AsiaPCB manufacturing is approaching a pivotal moment across the global electronics supply chain. For decades, the industry grew by adding equipment, expanding capacity, and relying on the accumulated experience of seasoned engineers. Today, the landscape is shaped by rising product complexity, increasingly sensitive material systems, tighter delivery expectations, and a worldwide shortage of technical talent. The traditional model is nearing its limits.
Connect the Dots: The Future of Designing for Reality—Outer Layer Imaging
12/24/2025 | Matt Stevenson -- Column: Connect the DotsIf you read my column regularly, you know I’m passionate about helping designers get the most from their designs. In my November column, I focused on designer best practices for the electroless copper component of the manufacturing process. The next step is outer layer imaging: the transition from digital to physical, and where the designer’s IP meets the board.