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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
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CEE PCB to Exhibit at Electronica 2024
October 31, 2024 | CEE PCBEstimated reading time: 1 minute
Tom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.
When making the announcement, Mr. Yang said, “This is a very important show for us, especially this year as we have started assuming our position on the global stage. We plan to have many of our experts at the show ready to meet and discuss new projects with current and future customers.”
Huizhou CEE Technology Inc. (Stock Code:002579), founded in 2000, provides a one-stop service from professional R&D to sales and manufacturing. Their offerings include a comprehensive suite of products such as rigid printed circuit boards (RPCB), flexible printed circuit boards (FPC), rigid-flex printed circuit boards (R-F) and flexible printed circuit assembly (FPCA). With three state-of-the-art factories located in key industrial hubs, CEE PCB is recognized as a key high-tech enterprise under the National Torch Program, hold the position of Vice Chairperson in the China Printed Circuit Industry Association (CPCA) and contribute as one of the industry standard setters.
CEE PCB will be exhibiting as Huizhou CEE Technology Inc. in booth C6.361.
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