Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Trouble in Your Tank: Can You Drill the Perfect Hole?
CEE PCB to Exhibit at Electronica 2024
October 31, 2024 | CEE PCBEstimated reading time: 1 minute
Tom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.
When making the announcement, Mr. Yang said, “This is a very important show for us, especially this year as we have started assuming our position on the global stage. We plan to have many of our experts at the show ready to meet and discuss new projects with current and future customers.”
Huizhou CEE Technology Inc. (Stock Code:002579), founded in 2000, provides a one-stop service from professional R&D to sales and manufacturing. Their offerings include a comprehensive suite of products such as rigid printed circuit boards (RPCB), flexible printed circuit boards (FPC), rigid-flex printed circuit boards (R-F) and flexible printed circuit assembly (FPCA). With three state-of-the-art factories located in key industrial hubs, CEE PCB is recognized as a key high-tech enterprise under the National Torch Program, hold the position of Vice Chairperson in the China Printed Circuit Industry Association (CPCA) and contribute as one of the industry standard setters.
CEE PCB will be exhibiting as Huizhou CEE Technology Inc. in booth C6.361.
Share on:
Suggested Items
Zhen Ding Posts June 2025 Monthly Revenue Report
07/08/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported June 2025 revenue of NT$12,823 million, up 19.68% YoY and up 8.75% MoM, setting a record high for the same period in the company’s history.
IBIDEN Earns Recognition in FTSE Russell ESG Indexes, Reinforcing Commitment to Sustainable Growth
07/07/2025 | IBIDENIBIDEN Co, Ltd. is pleased to announce that it has been selected for FTSE4Good Index Series for the tenth consecutive year, FTSE Blossom Japan Index for the nineth consecutive year, and FTSE Blossom Japan Sector Relative Index for the fourth consecutive year.
Results of the AT&S Annual General Meeting: Andy Mattes appointed Chairman of the Supervisory Board
07/04/2025 | AT&SAndy Mattes was newly elected to the Supervisory Board of AT&S Austria Technologie und Systemtechnik Aktiengesellschaft and is appointed until the 36th Annual General Meeting 2030. Georg Hansis was re-elected.
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.