Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Root-cause Analysis and Problem-solving
November 1, 2024 | Happy Holden, I-Connect007Estimated reading time: Less than a minute
An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.
I started my career in IC fabrication at Hewlett-Packard after serving in the Army and completing my graduate studies. In 1970, I was asked to help the PCB fabrication team members with some of their technical problems. I had two tools that most engineers in the PCB plant didn’t have at that time: engineering statistics, including design of experiments (DOE), and experience with problem-solving (TQC).
To read this entire article, which appeared in the October 2024 issue of PCB007 Magazine, click here.
Share on:
Suggested Items
Ensuring a Strong and Reliable Supply Chain
04/30/2025 | Marcy LaRont, PCB007 MagazineKelly Davidson, vice president of NCAB Group USA, discusses the company's stable performance in 2024 and positive outlook for 2025. She highlights NCAB's strategy of organic growth and strategic acquisitions amidst tariff concerns and global political uncertainty. Kelly emphasizes the importance of supply chain diversification, strong supplier relationships, and customer education, and notes NCAB's focus on defense production and maintaining a reliable supply chain.
Choosing the Right Strategic Path
04/29/2025 | Marcy LaRont, PCB007 MagazineTom Yang, CEO of CEE PCB, discusses the current economic challenges, noting reduced purchasing power post-pandemic. He highlights the growing demand for HDI in consumer electronics due to AI growth. Tom also expresses concerns about tariffs under the new U.S. administration, prompting CEE to diversify production locations, including new plants in Southeast Asia. He emphasizes the need for PCB manufacturers to adapt strategically amidst rising costs and fierce competition, particularly for mid-sized shops facing unique challenges in the industry.
Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
04/30/2025 | I-Connect007I-Connect007 is excited to share the latest episode in our new podcast series! In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.
Learning to Speak ‘Fab’
04/23/2025 | Ray Fugitt, DownStream TechnologiesOver the years, I’ve seen many PCB designers make DFM mistakes. At DownStream, I work with design and fabrication, and sometimes it feels as if the two segments are speaking completely different languages. But once designers learn to speak “fab,” many of these DFM challenges disappear.
Real Time with... IPC APEX EXPO 2025: EPOCH Expands With Automation
04/17/2025 | Real Time with...IPC APEX EXPOWith a 35-year history, EPOCH is expanding its operations in Bangalore, India, focusing on automation and customer collaboration. Phil Marcoux leads a task force for AI in PCB design, working with various companies to enhance collaboration, and cites that, historically, data sharing has provided the greatest challenge for AI development. Luckily, he says, that is changing. EPOCH combines AI and traditional methods in manufacturing, especially in product design.