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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Root-cause Analysis and Problem-solving
November 1, 2024 | Happy Holden, I-Connect007Estimated reading time: Less than a minute

An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.
I started my career in IC fabrication at Hewlett-Packard after serving in the Army and completing my graduate studies. In 1970, I was asked to help the PCB fabrication team members with some of their technical problems. I had two tools that most engineers in the PCB plant didn’t have at that time: engineering statistics, including design of experiments (DOE), and experience with problem-solving (TQC).
To read this entire article, which appeared in the October 2024 issue of PCB007 Magazine, click here.
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
OKI Launches 124-Layer Circuit Board Technology
05/22/2025 | Andy Shaughnessy, Design007 MagazineDuring PCB East, OKI Circuit Technology unveiled its latest innovation: a 124-layer printed circuit board. In this interview, “Dennie” Kazuo Kawahara, president of OKI Data Americas, and Eiichi Aki, sales and marketing specialist at OKI Circuit Technology, shared their insights into this feat. With plans for mass production starting in October, this board is designed for high-bandwidth memory applications, accommodating the demanding requirements of AI chips.
Pluritec: Growth Depends on Developing Next-gen Products
05/15/2025 | Marcy LaRont, PCB007 MagazineMaurizio Bonati, VP of sales at Pluritec, says a new generation of products has driven strong business performance and a significant backlog. However, there’s a concern about the potential negative impact of tariffs. Pluritec is taking proactive measures to minimize these effects by focusing on enhancing equipment capabilities, automating processes, and expanding customer support.
Ensuring a Strong and Reliable Supply Chain
04/30/2025 | Marcy LaRont, PCB007 MagazineKelly Davidson, vice president of NCAB Group USA, discusses the company's stable performance in 2024 and positive outlook for 2025. She highlights NCAB's strategy of organic growth and strategic acquisitions amidst tariff concerns and global political uncertainty. Kelly emphasizes the importance of supply chain diversification, strong supplier relationships, and customer education, and notes NCAB's focus on defense production and maintaining a reliable supply chain.
Choosing the Right Strategic Path
04/29/2025 | Marcy LaRont, PCB007 MagazineTom Yang, CEO of CEE PCB, discusses the current economic challenges, noting reduced purchasing power post-pandemic. He highlights the growing demand for HDI in consumer electronics due to AI growth. Tom also expresses concerns about tariffs under the new U.S. administration, prompting CEE to diversify production locations, including new plants in Southeast Asia. He emphasizes the need for PCB manufacturers to adapt strategically amidst rising costs and fierce competition, particularly for mid-sized shops facing unique challenges in the industry.