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Case Study: PCB Design Flaws Affect Product Cost

12/03/2024 | Matt Stevenson, ASC Sunstone
In the rapidly evolving aerospace industry, precision and reliability are paramount. “AeroTech Solutions” (not the company’s real name), an aerospace company specializing in satellite technology, recently faced a significant challenge that tested its operational integrity: A flaw identified in the PCB design of its latest satellite model led to unexpected delays and cost overruns.

Real Time with... SMTAI 2024: Summit Interconnect Doing Its Part to Rebuild Industry Expertise

10/29/2024 | Real Time with...SMTAI
In this interview from the recent SMTAI show, Nolan Johnson speaks with Jesse Vaughan from Summit Interconnect.  Jesse hits the highlights for some of Summit's programs to promote skilled workers in our industry—programs such as apprenticeships, Emerging Engineers, and more.

Designers Notebook: Implementing HDI and UHDI Circuit Board Technology

10/23/2024 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.

Introducing the Ultra HDI Learning Pavilion at SMTA International 2024

10/07/2024 | SMTA
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology.

Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4

09/25/2024 | I-Connect007 Editorial Team
Direct-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.
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