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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Root-cause Analysis and Problem-solving
November 1, 2024 | Happy Holden, I-Connect007Estimated reading time: Less than a minute
An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.
I started my career in IC fabrication at Hewlett-Packard after serving in the Army and completing my graduate studies. In 1970, I was asked to help the PCB fabrication team members with some of their technical problems. I had two tools that most engineers in the PCB plant didn’t have at that time: engineering statistics, including design of experiments (DOE), and experience with problem-solving (TQC).
To read this entire article, which appeared in the October 2024 issue of PCB007 Magazine, click here.
Suggested Items
Case Study: PCB Design Flaws Affect Product Cost
12/03/2024 | Matt Stevenson, ASC SunstoneIn the rapidly evolving aerospace industry, precision and reliability are paramount. “AeroTech Solutions” (not the company’s real name), an aerospace company specializing in satellite technology, recently faced a significant challenge that tested its operational integrity: A flaw identified in the PCB design of its latest satellite model led to unexpected delays and cost overruns.
Real Time with... SMTAI 2024: Summit Interconnect Doing Its Part to Rebuild Industry Expertise
10/29/2024 | Real Time with...SMTAIIn this interview from the recent SMTAI show, Nolan Johnson speaks with Jesse Vaughan from Summit Interconnect. Jesse hits the highlights for some of Summit's programs to promote skilled workers in our industry—programs such as apprenticeships, Emerging Engineers, and more.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
Introducing the Ultra HDI Learning Pavilion at SMTA International 2024
10/07/2024 | SMTAThe SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology.
Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4
09/25/2024 | I-Connect007 Editorial TeamDirect-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.