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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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Root-cause Analysis and Problem-solving
November 1, 2024 | Happy Holden, I-Connect007Estimated reading time: Less than a minute

An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.
I started my career in IC fabrication at Hewlett-Packard after serving in the Army and completing my graduate studies. In 1970, I was asked to help the PCB fabrication team members with some of their technical problems. I had two tools that most engineers in the PCB plant didn’t have at that time: engineering statistics, including design of experiments (DOE), and experience with problem-solving (TQC).
To read this entire article, which appeared in the October 2024 issue of PCB007 Magazine, click here.
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Ensuring a Strong and Reliable Supply Chain
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Choosing the Right Strategic Path
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Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
04/30/2025 | I-Connect007I-Connect007 is excited to share the latest episode in our new podcast series! In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.