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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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United Electronics Corporation Adds Shoda Optical V-Scoring System

09/01/2026 | United Electronics Corporation
New MVC-630D Brings Camera-Aligned Scoring Accuracy and Clean Aluminum Scoring to UEC's Franklin Park Facility.

Micro-Precision Technologies Achieves CMMC Level 2 Certification

08/24/2026 | BUSINESS WIRE
Micro-Precision Technologies, Inc. (MPT), a leading manufacturer of complex micro-electronics, is thrilled to announce it has achieved Cybersecurity Maturity Model Certification (CMMC) Level 2 using a Certified Third-Party Assessor Organization (C3PAO), with a perfect assessment score of 110/110.

Sumitomo Chemical Subsidiary to Establish of a Joint Venture with Samsung Electro-Mechanics for the Glass Core Substrate Business

07/13/2026 | Sumitomo Chemical
Sumitomo Chemical today announced that its wholly owned Korean subsidiary, Dongwoo Fine-Chem Co., Ltd. , has signed a joint venture agreement with Samsung Electro-Mechanics Co., Ltd. to establish a joint venture company that will engage in the business of glass core substrates for advanced semiconductor packages.

NCAB Posts Strongest EcoVadis Score Yet in 2026

07/08/2026 | NCAB
NCAB announced its highest EcoVadis result to date, earning an overall score of 79 out of 100, up from 73 in its previous assessment.

ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging

07/07/2026 | BUSINESS WIRE
Advanced Chip and Circuit Materials (ACCM) introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match the in-plane coefficient of thermal expansion of silicon while running on established organic-substrate manufacturing lines.
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