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Elementary, Mr. Watson A Designer's Dilemma—Metric or Imperial Units?

11/07/2024 | John Watson -- Column: Elementary, Mr. Watson
In the early 1800s, as trains began to spread across the United States, different companies built their tracks in ways that made sense to them. They chose their track widths (gauges) with no set standard. Some tracks were about four feet wide, with others at five or even six feet. Each company thought their choice was best, but this led to a big problem: Trains from one track couldn't run on another if the gauges didn't match. Often, trains had to stop at the state line for all their goods and passengers to switch trains, which cost extra time and money.

ViTrox Strengthens Its Mexico Presence with New Demo Room and Strategic Workforce Expansion

11/07/2024 | ViTrox
Year 2024 marks a significant year of growth for ViTrox in Mexico. In collaboration with SMTo, ViTrox has successfully established a state-of-the-art demo room, enhancing its capabilities to deliver advanced solutions to customers. As part of its commitment to the region, ViTrox is also expanding its local workforce, underscoring its dedication to innovation and service excellence in Mexico’s thriving market.

Weak Consumer Demand Leads to 28% Decline in DRAM Module Revenue in 2023

11/07/2024 | TrendForce
TrendForce’s latest analysis reveals that the global revenue for the DRAM module market reached US$12.5 billion in 2023—a YoY decline of 28%

MACOM Expands IC Design Expertise with Acquisition of ENGIN-IC

11/06/2024 | BUSINESS WIRE
MACOM Technology Solutions Holdings, Inc., a leading supplier of semiconductor products, announced today that it has acquired ENGIN-IC, Inc., a fabless semiconductor company that designs advanced Gallium Nitride (GaN) monolithic microwave integrated circuits (MMICs) and integrated microwave assemblies located in Plano, Texas and San Diego, California.

One Partial HDI Technique: mSAP 

11/05/2024 | Andy Shaughnessy, Design007 Magazine
Chris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
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