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10/09/2026 | I-Connect007
I-Connect007 is pleased to announce the release of the third episode of Engineering What’s Next, a six-part On the Line With… Qnity podcast series exploring the materials, technologies, and engineering challenges shaping the future of electronics. In this episode, “Rethinking PCB Design for AI Data Centers,” host Marcy LaRont speaks with Dr. Jin Hyun Hwang, business development specialist at Qnity, about how the extraordinary performance and power demands of artificial intelligence are changing the way engineers approach PCB design, materials, packaging, and system architecture.

TI Introduces ADC for Faster Telemetry in AI Data Centers

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Infineon Completes Acquisition of C2i Semiconductors

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