SEMICON Europa 2024 Opens Tomorrow to Highlight Innovation and Collaboration Powering Sustainable Growth

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SEMICON Europa 2024 opens tomorrow at Messe München in Munich, Germany, convening industry leaders from across the electronics design and manufacturing supply chain to exchange insights on the advancements and trends driving sustainable growth in the semiconductor sector. This year’s program emphasizes innovation across key areas such as advanced packaging, materials, MedTech, mobility, and cybersecurity, reflecting the industry’s commitment to shaping a more resilient and sustainable future.

SEMICON EuropaThemed Innovation and Collaboration: Powering Sustainable Exponential Growth, SEMICON Europa 2024, co-located with electronica, will spotlight critical industry topics including sustainability, green manufacturing, and workforce development. The event runs November 12-15 and offers a unique platform for collaboration and engagement as Europe’s premier exhibition and conference for the microelectronics supply chain. Registration is open.

“The semiconductor industry is expected to experience strong growth in the coming years, driven by increasing demand from artificial intelligence (AI) and other emerging technologies,” said Ajit Manocha, SEMI president and CEO. “Europe is well-positioned to lead technology innovations thanks to its world-class research institutions and growing infrastructure for semiconductor development. Challenges such as talent shortages, sustainability concerns, and shifting geopolitical dynamics underscores the need for global collaboration. SEMI plays a pivotal role, with SEMICON expositions, including SEMICON Europa, providing platforms for global collaboration, sharing knowledge, and accelerating innovation.”

“We are thrilled to delve into the innovations and partnerships shaping the future of the semiconductor industry in Europe and beyond,” said Laith Altimime, President of SEMI Europe. “SEMICON Europa 2024 presents the unique opportunity for companies across the supply chain to forge new business and technology partnerships and, together, continue driving the next era of industry transformation.”

“We are excited to witness the transformative impact of the EU Chips Act on the European semiconductor landscape,” said Luc Van den hove, President and CEO of imec. “As a leading R&D partner, imec is committed to uniting stakeholders around common semiconductor roadmaps. Our collaborative efforts will leverage combined expertise, infrastructure, and innovation to drive Europe’s digital economy forward. SEMICON Europa is the perfect platform to showcase these advances and highlight the immense potential of the four pilot lines to accelerate chip research, prototyping, testing and manufacturing across the value chain.”

Notable speakers at the CxO Summit on Tuesday, November 12 will include:

• Jari Kinaret, Executive Director, Chips Joint Undertaking (Chips JU)
• Luc Van den hove, President & CEO, imec
• Kai Beckmann, Member of the Executive Board and CEO Electronics, Merck KGaA
• Oliver Wyrsch, President and CEO, INFICON
• Stephan Haferl, CEO, Comet Group
• Pierre Barnabé, CEO, Soitec
• Frederic Godemel, Executive Vice President – Power Systems & Services, Schneider Electric
• Katharina Westrich, Global Vice President of Electronics, Semiconductors & Simulation Digital Industries, Siemens AG
• Barbara Frenkel, Member of the Executive Board Purchase, Porsche AG
• Carlos Mazure, Chief Strategy Officer, Institute of Microelectronics – A*STAR

Other SEMICON Europa Highlights

• ITF Chip into the Future – Powered by imec: Industry leaders will examine how the EU Chips Act can advance Europe’s semiconductor industry through collaboration, innovation, and investment. Discussions will cover key drivers, best practices, and the future of chip research and manufacturing.
• III-V Summit – Integrated Photonics: This summit will examine the role of III-V compound semiconductors in advancing next-generation electronics, focusing on their impact on high-performance, energy-efficient devices in telecommunications, computing, and photonics.
• Advanced Packaging Conference: Leading experts will discuss innovations in chiplets, heat dissipation, miniaturization, and other advanced packaging techniques essential for meeting the high-performance computing demands of modern AI applications.
• Fab Management Forum: Presenters will explore strategies to enhance semiconductor manufacturing efficiency and performance. Topics include global market strategies, smart manufacturing, innovations, environmental sustainability, supply chain resilience, and next-generation technologies.
• MEMS & Imaging Sensors Summit: This summit will examine how advancements in MEMS and imaging technologies are enhancing connectivity and driving innovation across sectors such as agriculture, automotive, and healthcare, with a focus on the integration of AI/ML and data fusion in next-generation applications.
• Executive Forum Programs: These sessions will provide updates on key technology trends, including Silicon Carbide (SiC) power semiconductors, smart mobility solutions, and AI-driven manufacturing processes. Industry experts will also address sustainable energy and challenges related to electrification, presenting the latest innovations aimed at overcoming these obstacles.
• TechARENA Programs: Focused on emerging technologies, TechARENA sessions will explore advancements in fields such as medical technology, quantum computing, and cybersecurity. The discussions will also address global challenges related to supply chain management, sustainability, and talent development, with an emphasis on the role of European research and innovation in driving the growth of the semiconductor industry.