Happy’s Tech Talk #37: New Ultra HDI Materials
It’s Only Common Sense: When Data Isn’t Enough, Trust Your Gut
Marcy’s Musings: Fueling the Workforce Pipeline
Aismalibar to Showcase Advanced Thermal Management Solutions for Electronics at electronica 2024
November 11, 2024 | AismalibarEstimated reading time: 1 minute
Aismalibar, a leading innovator in thermal management solutions, will exhibit at electronica 2024, the world’s foremost trade fair and conference for the electronics industry, held in Munich from November 12-15, 2024. Located at Booth B1.543, Aismalibar will highlight its latest advancements in Thermal Interface Materials (TIMs), Insulated Metal Substrates (IMS), and Thermal FR4 solutions tailored to meet the increasing demands for efficient heat dissipation and durability across various high-power applications.
Electronica, held biennially, gathers global technology leaders to showcase cutting-edge developments and forge strategic partnerships within the electronics industry.
Featured Product Highlights
- Thermal Interface Materials (TIMs): Aismalibar will introduce its new generation of high-performance TIMs, BOND SHEET CURED GLASS FREE, which provide outstanding thermal conductivity and durability, critical for the growing needs of high-power-density applications. These materials are designed to bridge gaps between heat-generating components and heatsinks, ensuring optimal heat dissipation in EV battery packs and other high-performance electronics.
- Thermal FR4 (CCLs): HTC 3.2w HIGH TG BOND SHEETS AND THIN LAM are used in PCB manufacturing to improve thermal management and reduce thermal vias. The use of Aismalibar's thermal FR4 can reduce the operating temperature of power components by up to 20%, which will result in improved output and extended lifespan.
- Insulated Metal Substrates (IMS): Aismalibar will also feature its latest IMS solutions, COBRITHERM ULTRATHIN 5W and 8W, designed for applications requiring both electrical insulation and efficient thermal conductivity. These substrates are ideal for power electronics, enabling manufacturers to manage higher power outputs without compromising system stability or lifespan.
Aismalibar’s expert team will be available at Booth B1.543 to discuss its comprehensive range of thermal management solutions and how these innovations support the performance and reliability of high-power electronic applications.
Share on:
Suggested Items
Indium Expert to Address Thermal Challenges at TestConX 2025
02/04/2025 | Indium CorporationIndium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Advanced Chip and Circuit Materials Shows 224 Gb/s Laminates and Prepregs at DesignCon 2025
01/27/2025 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) will be showing its high-performance circuit materials, including its Celeritas Series laminates and prepregs at the DesignCon 2025 exhibition.
ACCM Launches CeleritasSF & CeleritasBU for Ultra-High-Speed PCBs
01/27/2025 | PRNewswireAdvanced Chip and Circuit Materials Inc. (ACCM), a US-based manufacturer of skew free, ultra-thin copper-clad laminates and dielectric prepreg materials used to fabricate high layer count PTH, Buildup and UHDI multilayer printed circuit boards (PCBs), announced the introduction of the CeleritasSF and CeleritasBU series of laminates and prepregs, which enable PCIe Gen 6 & 7 and data rates of 224 Gb/s per channel.
Indium to Showcase Durafuse Solder Technology at NEPCON Japan
01/21/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.