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Ansys to Integrate NVIDIA Omniverse

03/20/2025 | ANSYS
Ansys announced it will offer advanced data processing and visualization capabilities, powered by integrations with NVIDIA Omniverse within select products, starting with Fluent and AVxcelerate Sensors.

DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI

03/19/2025 | DuPont
DuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo.

Mycronic’s Global Technologies Makes Acquisition in France

03/13/2025 | Mycronic
Mycronic’s Global Technologies division has acquired Hprobe, a company headquartered in Grenoble, France, which has developed a unique technology for high-speed magnetic testing of Magnetoresistive Random Access Memories (MRAMs) and magnetic sensors.

GlobalFoundries, MIT Collaborate to Advance Research and Innovation on Essential Chips for AI

03/04/2025 | GlobalFoundries
GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) announced a new master research agreement to jointly pursue advancements and innovations for enhancing the performance and efficiency of critical semiconductor technologies.

Flexible Thinking Flexible Circuit Technology—Looking Back and Forward

03/03/2025 | Joe Fjelstad -- Column: Flexible Thinking
Flexible circuit technology came on the scene as a solution largely for niche applications, however, the technology has emerged in recent years as a cornerstone of modern electronics. Today, the technology is enabling a broad range of new product designs across industries. From wearable devices and medical implants to foldable smartphones and numerous automotive applications, flexible circuits are arguably at the heart of much of the next generation of innovations.
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