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Advanced Electronics Packaging Digest

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Nortech Secures Optical Interconnect Patents for MRI and Aerospace

11/11/2026 | Globe Newswire
Nortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced that the U.S. Patent and Trademark Office has granted the Company two patents covering its active optical cable technology.

Finding Lead Time in the Messy Middle

11/11/2026 | Ralph Richart, MetisLogic
As electronics manufacturers, we devote significant effort to the production floor, always seeking to build products better and faster. We measure placement speed, optimize changeovers, monitor yield, and invest in equipment. Those investments matter. But in many high-mix and new product introduction (NPI) environments, the greatest opportunity to shorten lead time sits between the customer order and the start of production. I call this the Messy Middle. It is the period when a quoted job becomes a buildable job.

Summit Interconnect Acquires Mega Circuit, Expanding RF and Microwave Capabilities

11/09/2026 | Summit Interconnect
Acquisition strengthens Summit’s domestic manufacturing network with dedicated expertise in PTFE-based printed circuit boards for defense and commercial applications.

NOTE Finland Joins PIA to Strengthen Defense Industry Collaboration

11/09/2026 | NOTE
NOTE Finland provides electronics manufacturing services ranging from prototypes to series production, including PCBAs and complete box-build products.

Ventec, MICAM to Establish European CCL Joint Venture in Ireland

11/09/2026 | Ventec
Ventec International Group, a Taiwanese specialist manufacturer of copper-clad laminates (CCL) and prepregs (PP) serving a global customer base, and MICAM a long-established manufacturer of advanced composites to the industrial, security and defence industries are developing a joint venture to establish copper-clad laminate production at MICAM’s manufacturing facility in Mallow, Ireland.
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