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TRI Wins Two EM Asia Innovation Awards for AOI and ICT

07/08/2020 | TRI
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announces that it was awarded two 2020 EM Asia Innovation Awards in two categories.

Step Stencil Technologies and Their Effect on the SMT Printing Process

12/21/2017 | Greg Smith and Bill Kunkle, BlueRing Stencils, and Tony Lentz, FCT Assembly
Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.

December Issue of SMT Magazine Available Now

12/04/2017 | I-Connect007
The solder paste printing process accounts for almost 70% of PCB assembly defects. The December 2017 issue of SMT Magazine, which is available now, looks into the critical factors causing these challenges, and features strategies, tips and tricks, to help assemblers improve the yield and quality in the solder paste printing operation.

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

03/30/2016 | FCT Assembly
FCT’s 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead-free alloys.
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