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International Electronics Circuit Exhibition (Shenzhen) Coming Dec. 4–6
November 14, 2024 | Edy Yu, I-Connect007Estimated reading time: 6 minutes
What specific measures have been taken to attract more attendees, both upstream and downstream in the manufacturing supply chain, particularly regarding buyer resources, end-manufactor technology exchange?
This year, the exhibition is committed to expanding its downstream customer base and focusing on key fields such as new energy vehicles, telecommunications, computing, consumer electronics, and industrial control. The goal is to create an efficient platform for exhibitors to connect with specialized downstream buyers.
And regarting end-manufacturer technology exchange, many exhibitors will showcase breakthrough products and technologies that integrate AI. The HKPCA Show provides a trade and exchange platform where industry professionals can deeply understand and experience cutting-edge technology, and directly interact with leading companies, exploring cooperation opportunities.
What are some of the topics that will be covered in the conference portion of the show?
The Conference will be held in Halls 5 and 6, featuring notable industry experts and prominent speakers. Sessions will cover topics such as AI, smart manufacturing, digital upgrades, and the latest market trends, jointly exploring how AI is leading industry development trends. We believe this program will offer attendees an invaluable opportunity to gain insight into the future and the pace of the industry.
What are some of the networking and other activies you will be hosting as part of the 2024 show?
A golf tournament and, of course, a welcome dinner are among a series of planned networking and collaboration opportunities for industry professionals.
Can you briefly summarize the current state of AI and automation technology applications in the industry and the technology and development trends that can be expected in the PCB industry?
Automation technology has been extensively integrated and applied within the PCB industry. Automation supports various steps of the process, from initial material cutting and automatic board polishing to automated drilling solutions, automated alignment and pressing, and inner and outer layer circuitry. AI applications are also becoming more widespread. AI-driven machine vision is used for comprehensive PCB board inspection, enhancing manufacturing quality and production efficiency. By utilizing AI, the entire process from receiving an order through production can be intelligently managed, boosting overall efficiency. Highly automated production lines, real-time data analysis, and intelligent logistics are helping achieve smart manufacturing and digital transformation.
The increasing demands for integration, complexity, and precision in PCB products driven by AI will boost the share of high-end PCB products such as high density interconnect (HDI) boards and packaging substrates. The development of communication technologies and Internet of Things (IoT) requires that PCBs can process higher data rates and more connections, which drives the development of high-speed and high-frequency PCB products. In terms of materials, organic substrates are widely used with their excellent electrical insulation and machinability; ceramic substrates with their high thermal conductivity and stability, are ideal for high-power and high-temperature applications; metal substrates are specialized in high performance and high thermal conductivity needs; and glass-core substrates have promising potential to surpass the current limits of organic base materials.
As an authoritative organization in the industry, how does HKPCA see current market trends?
The global PCB industry is expected to experience significant growth in 2024. According to the report from Prismark, a market research firm, the global PCB output value is projected to reach approximately $73.3 billion in 2024, a year-on-year growth of about 5.5%. This indicates that the industry is recovering from a previous downturn and is expected to maintain steady growth in the coming years.
With continuous breakthroughs in new-generation information technologies such as 5G, artificial intelligence, IoT, Industry 4.0, cloud servers, storage devices, and automotive electronics, the demand for high-performance, high-density PCB products increasingly drive market demand. Particularly, AI is driving the demand for complex computation and data processing, which is opening a new growth cycle for the PCB market.
Despite the promising outlook, the PCB industry also faces some challenges, such as high R&D costs of new technology, intensified market competition, and uncertainties in the global supply chain. Companies must invest in continuous innovation and upgrades to meet market demands and keep up with technological advancements.
It sounds like it is going to be a great show. Where can folks register to attend or exhibit?
All registrations are open, and audience group registrations are also open. You can register at hkpcashow.org. Benefits for pre-registered attendees include express badge collection, entry into a raffle, and prize draws on-site. You can also reach out to us on our official WeChat account "PCB_SMT."
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Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
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UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.