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Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?

02/19/2025 | Chrys Shea, SHEA Engineering Services
UHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago. 

UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2

02/06/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.

Happy’s Tech Talk #37: New Ultra HDI Materials

02/03/2025 | Happy Holden -- Column: Happy’s Tech Talk
Some new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)

SMTA UHDI Symposium 2025, Part 2: State of the Art

01/29/2025 | Marcy LaRont, I-Connect007
A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.

SMTA UHDI Symposium 2025, Part 1: Challenges and Solutions

01/28/2025 | Marcy LaRont, I-Connect007
SMTA hosted its second annual Ultra High Density Interconnect Symposium, a conference on cutting-edge PCB technology, on Jan. 23, 2025, at the Peoria Sports Complex in Arizona. A highly pro-business state with a special affection for the tech sector, Arizona is home to the biggest Intel semiconductor fab in the United States and the new TSMC chip fab. With an intimate group of approximately 50 attendees, the SMTA event offered a great forum for learning, interactive discussion, and networking.
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