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Driving Innovation: Mastering Panel Warpage

09/23/2025 | Simon Khesin -- Column: Driving Innovation
During the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.

Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T

09/05/2025 | Akrometrix LLC
Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.

Akrometrix LLC Reports a Record Year of Revenue for 2024

03/04/2025 | Akrometrix LLC
Akrometrix, the global leader in Thermal Warpage Metrology, announces financial results for the full year 2024.

Akrometrix Announces 30 Year Anniversary as Industry Leader in Thermal Warpage Metrology

02/25/2025 | Akrometrix LLC
Akrometrix is celebrating their 30 year anniversary as an industry leader in thermal warpage metrology. Professor Ifeanyi Charles Ume founded Akrometrix out of Georgia Tech 30 years ago to address issues in PCB flatness using the shadow moiré warpage measurement technique. 

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5

12/23/2024 | I-Connect007 Editorial Team
Chapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
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