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IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
IPC-8401 is the first of what is expected to be a series of standards that will move beyond the automotive industry and cover IME for smart home products and aviation.
The standard was developed by the D-83A In-Mold Electronics Interconnection Task Group, a group comprised of experts worldwide, led by Paavo Niskala from TactoTek and Iker Arroyo Moso from Eurecat. Niskala says, “The automotive industry has driven the development of IME because it significantly reduces the cost, weight, waste, and energy required to produce vehicle interior parts. Rather than using a PCB in a plastic molding with features interacting with PCB sensors, IME components are integrated directly into the plastic molding, making the manufacturing process more streamlined, sustainable, and efficient.
Key guidelines covered in IPC-8401 include:
- Manufacturing Processes: Introduction to the manufacturing processes involved in producing in-mold electronics.
- IME Part Structure: This defines a standardized IME part structure supporting the design and processing of IME parts for mass production.
- Candidate Materials: Provides material selection criteria and recommendations as industry-adopted practices, covering all materials, including substrates, functional inks, SMT components, SMT adhesives, and injection molding resins.
- Production Test Methods: Defines best practices and criteria for process controls-driven testing throughout the manufacturing processes.
To purchase IPC-8401, visit the IPC Store. To participate in IPC standards development committee meetings like the D-83A In-Mold Electronics Interconnection Task Group, visit the IPC’s committee page.
