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Advanced Electronics Packaging Digest

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Suggested Items

HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

The Right Approach: Old Philosophies, New Tools

10/13/2026 | Steve Williams -- Column: The Right Approach
Quality management as a discipline was built by a handful of people who never touched a neural network, yet whose ideas map onto AI with almost eerie precision. Dr. Walter Shewhart, Dr. Edwards Deming, Dr. Joseph Juran, Philip Crosby, Dr. Kaoru Ishikawa, and Shigeo Shingo each built a philosophy around a specific lever for improving quality, including statistical rigor, reducing variation, prioritizing effort, eliminating defects, involving the workforce, and error-proofing the process itself.

EMS Plugs in to Capitol Hill

10/12/2026 | Daniel Baker, director, policy communications & public affairs, Global Electronics Association
Trick question! Electronics manufacturing services (EMS) companies turn parts and components into the systems and products that power every sector of today’s economy, including agriculture and healthcare, to autos and the F‑35.

Microchip Technology Acquires VORAGO Technologies

10/09/2026 | Globe Newswire
Microchip Technology Incorporated, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced that it has acquired VORAGO Technologies, Inc., a privately held provider of radiation-hardened and radiation-tolerant microcontrollers (MCUs) and microprocessors (MPUs), based in Austin, Texas.

Global Electronics Association Names Jason Palmi Chief Financial Officer

10/06/2026 | Global Electronics Association
The Global Electronics Association announced that Jason Palmi has joined the organization as Chief Financial Officer.
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