Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology
November 22, 2024 | Real Time with... electronicaEstimated reading time: Less than a minute
Marcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production. Click here to listen.
For more coverage from electronica 2024 or to visit our event photo gallery, click here.
Suggested Items
Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer
12/23/2024 | EINPresswire.comThailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Flexible Printed Circuit Boards Market Expected to Reach $51.05 Billion by 2031 at a CAGR of 11.2%
12/20/2024 | EINPresswire.comA new report by Coherent Market Insights forecasts the global flexible printed circuit boards (FPCB) market to reach $51.05 billion by 2031, reflecting a strong compound annual growth rate (CAGR) of 11.2% from 2024.
The ICAPE Group Expands Its Activities in the United Kingdom With the Acquisition of ALR Services Ltd.
12/20/2024 | BUSINESS WIREThe ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, today announced the acquisition of 100% of the capital of ALR Services Ltd, a British PCB distributor.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in