Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions

04/03/2025 | Real Time with...IPC APEX EXPO
Michael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.

Real Time with... IPC APEX EXPO 2025: Maximizing Cost Savings in PCB Design With NCAB

04/02/2025 | Real Time with...IPC APEX EXPO
Kelly Dack and Lonnie Port discuss NCAB's role in the printed circuit board industry. With 30 years of experience, NCAB emphasizes the importance of customer involvement during the design process to achieve significant cost reductions.

'Let’s Talk Production Test' with Bert Horner of The Test Connection, Inc. at SMTA Long Island Meeting

04/02/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce that its President, Bert Horner, will present at the SMTA Long Island Chapter Technical Meeting & Dinner on Wednesday, April 16, 2025. The event will take place at the Radisson Hotel Hauppauge in Hauppauge, NY.

CEE PCB Appoints Markus Voeltz to Business Development Director Europe

04/02/2025 | CEE PCB
CEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and began providing local support in March 2025. With 25 years of experience in the industry, the company is enhancing its commitment to European customers by providing more direct collaboration for technical inquiries and advice.

BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges

04/02/2025 | BEST Inc.
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in