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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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HANZA Wins New Customer in Germany
November 25, 2024 | HANZAEstimated reading time: Less than a minute
HANZA AB, listed on Nasdaq Stockholm, continues to secure new business, and has entered a manufacturing partnership with a leading German company specializing in advanced measurement equipment for mechanical components.
HANZA will manufacture control cabinets, a critical part of the customer’s state-of-the-art measurement systems, designed for demanding industries such as automotive, aerospace, marine, and energy.
The initial order, valued at approximately 1.4 MEUR annually, marks the start of a promising partnership with significant potential for future business expansion. Manufacturing will commence in 2024 at HANZA's German cluster, where the company leverages local expertise and advanced technology to exceed customer expectations.
“We are proud to have been entrusted with supplying a world leader,” says Sascha Berent, Sales Director DACH. “This partnership underlines our strength as a strategic manufacturing partner and our ability to meet the highest demands on quality and precision.”
This order also reflects a positive trend, with HANZA securing new customers despite a continued weak economy. It demonstrates the company's attractiveness as a strategic manufacturing partner, irrespective of the economic climate.
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