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Skunk Works Demonstrates Airborne Battle Management of AI-Controlled Aircraft

11/27/2024 | Lockheed Martin
Lockheed Martin Skunk Works, in partnership with Lockheed Martin's Demonstrations and Prototypes organization and the University of Iowa's Operator Performance Laboratory (OPL), showcased a crewed-uncrewed teaming mission where an airborne battle manager issued real-time commands to AI-controlled aircraft through a touchscreen pilot vehicle interface (PVI).

Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment

11/25/2024 | Real Time with... electronica
In this interview from electronica 2024, Pete Starkey speaks with Andrea Furnari, VP of Electronic Test Products Business Unit for SPEA. The discussion revolves around AI integration in test equipment, trends in substrate materials, and SPEA's focus on R&D.

Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology

11/22/2024 | Real Time with... electronica
Marcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production.

Meet Polar's New Product Specialist Jess Hollenbaugh 

11/21/2024 | Andy Shaughnessy, I-Connect007
At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.

Advanced Packaging: Preparation is Now

11/20/2024 | Nolan Johnson, SMT007 Magazine
A new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
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