Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

LITEON September Sales Rise 22% on Strong AI and Cloud Demand

10/14/2026 | LITEON Technology
LITEON’s consolidated revenue for September reached NT$18.8 billion, representing a 22% Y-o-Y increase.

Flex Acquires EPC Power to Expand AI Data Center Power Solutions

10/14/2026 | Flex
Flex announced that it has completed its acquisition of EPC Power, a leading provider of intelligent power conversion solutions for data center and grid applications.

IC-Link by imec Expands TSMC Collaboration for Advanced-Node Chip Design

10/01/2026 | Imec
IC-Link by imec, imec’s design and manufacturing service provider for ASICs and silicon photonics, and TSMC announced an expansion of their collaboration aimed at simplifying customer access to advanced-node semiconductor design capabilities.

Zhen Ding Prices $800M Overseas Convertible Bonds

09/24/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited successfully priced its sixth unsecured overseas convertible bonds issuance on September 22, 2026, raising a total of US$800 million (approximately NT$25.2 billion).

REPORT: Closing the European Gap in Data Centre, Cloud, and AI Infrastructure Manufacturing

09/17/2026 | Global Electronics Association
The Global Electronics Association released From Chips to Systems: Building an End-to-End EU Strategy for Data Centre, Cloud Infrastructure and AI, a joint report with DECISION Études & Conseil. Europe is one of the world’s three largest markets for AI data centres.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in