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Suggested Items

Interlocking Material Management and Quality

07/01/2026 | Nolan Johnson, SMT007 Magazine
Cogiscan’s Greg Benoit recently published a white paper series on material tracking in the EMS sector, in which he argues that achieving a fully integrated MES infrastructure requires more than a software package to make the system work at its best. In this interview, Greg discusses the white paper series in more depth. You can download the two-part Cogiscan white paper, Strategies for Efficient Material Management in Circuit Board Assembly, from our Industry Resource Center.

Don't Buy AI, Learn It: A Fabricator's Guide to Getting Started, Part 2

06/23/2026 | Sean Patterson, CrossGen AI
In Part 1, I covered common challenges encountered on a PCB shop floor, the missteps companies make when attempting to implement AI, and best practices to start that journey with a significantly higher likelihood of success. I identified six areas where AI’s strength in aggregating data can make the shop floor run more smoothly, create better process documentation across departments and between shifts, and even help capture tribal knowledge.

It’s Only Common Sense: Just Imagine…

06/22/2026 | Dan Beaulieu -- Column: It's Only Common Sense
There’s an old story that says we're all artists in first grade. Just ask a room full of 6-year-olds. One kid draws dinosaurs wearing sneakers. Another builds a spaceship out of cereal boxes and glue sticks. Somebody paints the sky green because they feel like it. Nobody apologizes for their ideas or worries about being judged. They just create without fear. But, as the story goes, we get older. We become more experienced and practical. We learn rules, structure, and how business is “supposed” to work. We slowly trade crayons for spreadsheets and imagination for caution. Little by little, we retire the most creative part of ourselves long before we retire from work.

Thermoreflectance and Solving the Thermal Puzzle in 3D Packaging

06/11/2026 | Marcy LaRont, I-Connect007
Advanced packaging and 3D heterogeneous integration are rapidly redefining the next phase of the semiconductor industry, delivering unprecedented performance gains while posing significant thermal management challenges. In this interview, Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex packages, interposers, and TSV structures.

Rethinking Resilience: How Electronic Component Recovery Is Reshaping the Supply Chain

06/11/2026 | Rob Ronan, Retronix Ltd.
The first article in this series explored how semiconductor shortages exposed the fragility of global supply chains. But shortages are only one part of a broader challenge. The electronics supply chain has always been complex, but in recent years it has become something else entirely: unpredictable. From pandemic-driven disruptions to geopolitical tensions and sudden demand spikes, manufacturers have been forced to confront the hard truth that traditional sourcing strategies are no longer enough.
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