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Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative

01/13/2025 | BUSINESS WIRE
The U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary codesign of hardware and software and enable processing of vast quantities of data at unprecedented speeds.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

Micron Appoints Mike Cordano as Executive VP of Worldwide Sales

01/06/2025 | Micron
Micron Technology, Inc. announced it is appointing Mike Cordano as the company’s executive vice president of worldwide sales, effective immediately. Cordano will succeed Mike Bokan, who announced a few months ago his intention to retire from Micron in fiscal 2025 after more than twenty-eight years with the company.

American Standard Circuits' John Johnson to Speak at Ultra HDI Symposium

01/06/2025 | American Standard Circuits
Anaya Vardya, president and CEO of American Standard Circuits, announced that his company’s Director of Quality/Advanced Technology, John Johnson, will be speaking at this year’s Ultra HDI Symposium, Jan. 23, in Peoria, Arizona.

HaiLa Technologies Releases Extreme Low-Power Development Platform for Wi-Fi Communications

01/06/2025 | BUSINESS WIRE
HaiLa Technologies, a supplier of advanced low power wireless semiconductor solutions, introduced a new development platform to better support developers and researchers in creating extremely low power connected solutions.
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