ROHM Semiconductor, Valeo Co-Develop the Next Generation of Power Electronics
December 3, 2024 | Globe NewswireEstimated reading time: 2 minutes
ROHM Semiconductor and Valeo, a leading automotive technology company, today announced they are collaborating to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. As a first step, ROHM will provide its 2-in-1 Silicon Carbide (SiC) molded module TRCDRIVE pack™ to Valeo for future powertrain solutions.
Valeo is broadening access to efficient, electrified mobility across various vehicle types and markets from the smallest one (ebikes), through the mainstream (passenger cars) to the largest one (eTrucks). By combining Valeo’s expertise in mechatronics, thermal management and software development with ROHM’s power modules, Valeo drives the power electronics solution forward, contributing to the performance, efficiency, and decarbonization of automotive systems worldwide.
ROHM and Valeo have been collaborating since 2022, initially focusing on technical exchanges aimed at improving the performance and efficiency of the motor inverter – a key component in the propulsion systems of electric vehicles (EVs) and plug-in hybrids (PHEVs). By refining power electronics, both companies aim to offer optimized cost/performance by delivering higher energy efficiency, reducing heat generation thanks to an optimized cooling and mechatronic integration, and increasing overall reliability with a SiC packaging.
“We are pleased to support Valeo, a renowned automotive supplier, with our power semiconductors. ROHM’s TRCDRIVE pack provides high power density, leading to an improved power efficiency. Together, we contribute to the development of highly efficient powertrains by fostering the collaboration with Valeo,” said Wolfram HARNACK, President ROHM Semiconductor GmbH.
“This partnership marks, for Valeo Power Division, a significant step forward in delivering advanced and high-efficient power electronics,” says Xavier DUPONT, Valeo Power Division CEO. “Together, we aim to set new industry standards for high voltage inverters and accelerate the transition towards more efficient and affordable electric mobility.”
These evolutions are all essential to supporting the growing demand for longer range, faster charging capabilities and, overall, a high-performance and an affordable inverter for BEVs and PHEVs.
Valeo will start supplying a first series project in early 2026. ROHM and Valeo will contribute to the improvement of efficiency and downsizing of Valeo’s next generation of xEV inverters.
Background on ROHM’s TRCDRIVE pack
TRCDRIVE pack is a trademark for ROHM’s SiC molded module developed for traction inverter drives. This product features high power density and a unique terminal configuration, solving the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours. Because SiC enables low-loss power conversion under high-voltage conditions, combining Valeo's component technology, casing design and thermal management expertise with ROHM's power module creates a synergistic effect. Through both companies’ collaboration in automotive power electronics, they contribute to achieving a decarbonized society by enhancing the performance and efficiency of the motor inverter.
Suggested Items
AI Helps Build Smarter, More Resilient Power Grids
05/16/2025 | BUSINESS WIREAs society’s reliance on electricity deepens, artificial intelligence (AI) is reshaping how we manage power grids and optimize energy sources.
Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity
05/14/2025 | BUSINESS WIRECorning Incorporated, a world leader in glass science and optical physics, today announced a collaboration with Broadcom Incorporated, a leading supplier in the semiconductor field, on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers.
TT Electronics Secures £50 Million in New Contract Awards for Classified U.S. DoD Defense Programs
05/12/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced today that it has been awarded significant new contracts totalling over £50 million to support classified U.S. Department of Defense (DoD) programs.
LITEON Technology Reports Consolidated April Sales of NT$13.4 Billion Up 27% YoY
05/09/2025 | LITEON TechnologyLITEON Technology reported its April consolidated revenue of NT$13.4 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 27% YoY.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.