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Happy’s Tech Talk #35: Yields March to Design Rules

12/12/2024 | Happy Holden -- Column: Happy’s Tech Talk
Ultra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”

Strip Etch Strip: Episode 9 of On the Line With... Designing for Reality Podcast Now Available

07/25/2024 | I-Connect007
Don't miss the latest episode of "On the Line With... Designing for Reality," where we walk through the PCB manufacturing process. At this stage, we have a panel made up of all the internal layers laminated together, through-holes drilled, and the outer layer copper features covered with a protective layer of tin.

DIS: Thriving With New Processes and Technologies

07/23/2024 | Barry Matties, I-Connect007
What does it take to really thrive in today’s business environment? Will it require big changes, or can you make small, incremental improvements? Jesse Ziomek, global sales director and product manager at DIS, Inc., a company that designs and manufactures automation equipment, focuses on strategies for thriving in the PCB industry by emphasizing cost reduction through smart robotic solutions and addressing bottlenecks to optimize yields.

All Flex Solutions Installs New Inner Layer Factory

12/05/2023 | All Flex Solutions
All Flex Solutions has purchased and installed a new inner layer factory in their Rigid Flex Center of Excellence located in Minneapolis. This continues their investments in plants and technology to support customers’ needs for capability, speed and increased yield.

Indium Corporation Introduces New Cleanable SiPaste for Fine Feature Printing

12/28/2022 | Indium Corporation
Indium Corporation has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.
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