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LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.

07/31/2025 | PR Newswire
LQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.

Clear Demand Signal Needed for CHIPS Success

08/01/2025 | I-Connect007 Editorial Team
In July, the National Defense Industrial Association’s (NDIA) Electronics Division released a white paper titled Clear Demand Signal Needed for CHIPS Success. The paper highlights the importance of the CHIPS and Science Act’s $52 billion investment in revitalizing secure domestic semiconductor production, but also raises the alarm that the Act mainly addresses supply challenges and has not established mechanisms to ensure ongoing demand for U.S.-based microelectronics production.

Japan’s OHISAMA Project Aims to Beam Solar Power from Space This Year

07/14/2025 | I-Connect007 Editorial Team
Japan could be on the cusp of making history with its OHISAMA project in its quest to become the first country to transmit solar power from space to Earth, The Volt reported.

Cetec ERP Expands into Larger Office to Support Continued Growth

07/11/2025 | Cetec ERP
Cetec ERP, a leading provider of cloud-based ERP software for manufacturers, has officially relocated to a larger, modern office facility in central Austin as of July 2, 2025.

OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

06/21/2025 | BUSINESS WIRE
OKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
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