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Suggested Items

Designers Notebook: Heterogeneous Interposer Design Challenge, Part 2

02/16/2026 | Vern Solberg -- Column: Designer's Notebook
As the need grows for higher processing speed and the expanded functionality required for newer generations of central processing units (CPUs), the necessity for higher-density interconnect solutions is paramount. The current trend toward furnishing a single, monolithic system-level semiconductor package has become a serious yield issue in fabrication. For example, with all of the peripheral supporting functions on a single die platform, wafer fabrication yields are often below target and, although the CPU portion of a monolithic semiconductor may be perfect, if one or more of the supporting functions on the same die fails, the entire processor unit must be discarded. 

Ukraine expands partnership with ICEYE

01/20/2026 | ICEYE
ICEYE, the leader in European defense tech and  Synthetic Aperture Radar (SAR) satellite operations, and a customer within the Ministry of Defence of Ukraine have signed a new agreement to significantly expand their cooperation in space-based intelligence.

Global Electronics Association Releases Fall Schedule of Instructor-led Courses

10/20/2025 | Corey Lynn, Global Electronics Association
Whether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.

New Fil Arzola Class: Designing for the Future, and for Sustainability

10/07/2025 | Andy Shaughnessy, I-Connect007
If you have not yet taken a class from Fil Arzola, you are missing out. In late October, Fil will be teaching the class "Building Sustainable Model-Based PCBs," speaking from the design perspective. I had the pleasure of catching this course at last year's IPC APEX EXPO, and I walked away with a lot to think about. I asked Fil to discuss his upcoming course. Registration is open now.

Armstrong Asia Signs MOU with Checkmate Capital Group to Explore Strategic Collaboration

09/15/2025 | GlobeNewswire
Armstrong Asia, a leading Singapore-based manufacturer of flexible material solutions with 16 factories across 7 countries in Asia, has signed a Memorandum of Understanding (MOU) with Checkmate Capital Group, LLC (“Checkmate Capital”), a U.S.-based investment and advisory firm active in the Asia-Pacific and North American regions, focused on cross-border transactions in the life sciences, medical technology, and other industries.
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