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Suggested Items

An Inspiring Journey From Animation to PCB Design

01/20/2025 | Marcy LaRont, I-Connect007
I recently spoke with Melissa Martinez, a PCB design student in John Watson’s class at Palomar College. In this interview, Melissa shares her inspiring journey from the world of animation to the realm of printed circuit board design. Introduced to the field by her father, an engineer at Northrop Grumman, she discovered her passion for PCB design through John’s curriculum at Palomar. Her story highlights the importance of mentorship and education in attracting new talent to the industry, encouraging young individuals to explore opportunities they may not yet know exist.

Imagineering, Accutrace Announce Strategic Merger to Enhance Service and Capabilities

01/17/2025 | Newswire.com
Imagineering Inc., a renowned PCB Fabricator and Assembler, is pleased to announce its merger with Accutrace Inc., a leader in providing time-critical, technologically advanced development and manufacturing services for the electronics industry.

PCB Market Expanding at 3.62% CAGR, To Reach $100 Billion by 2032

01/17/2025 | EINPresswire.com
The global Printed Circuit Board (PCB) Market was valued at US$72.63 billion in 2023 and is projected to exhibit steady growth over the coming years.

See You in Vienna: Speaker Spotlight on PEDC

01/16/2025 | I-Connect007 Editorial Team
Vienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.

NAMICS Brings Innovative Thermoset Materials to PCB Fabrication

01/16/2025 | Andy Shaughnessy, Design007 Magazine
At PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below.
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