SIA Commends CHIPS Act Incentives for Coherent, SkyWater Technology, X-FAB
December 9, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce, Coherent, SkyWater Technology, and X-FAB. The Coherent project in Sherman, TX will expand production of indium phosphide wafers. The SkyWater Technology project in Bloomington, MN will expand mature-node foundry capacity. And the X-FAB project in Lubbock, TX will expand production of silicon carbide wafers.
“The CHIPS Act investments announced today will reinforce U.S. supply chains for current-generation and mature-node semiconductors, thereby helping to strengthen America’s economic and national security. We applaud Coherent, SkyWater, and X-FAB for investing ambitiously in the domestic semiconductor ecosystem, and we applaud the Commerce Department for advancing these important incentives.”
The CHIPS Act is on track to strengthen American manufacturing, create jobs, boost economic growth, and promote national security. The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032.
The U.S. Department of Commerce previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
05/01/2026 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community.
SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification
05/01/2026 | SEMIThe Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
Teradyne Reports New Record High in Q1 2026
04/30/2026 | BUSINESS WIRETeradyne, Inc. reported revenue of $1,282 million for the first quarter of 2026 of which $1,111 million was in Semiconductor Test, $91 million in Robotics, and $80 million in Product Test. GAAP net income for the first quarter of 2026 was $398.9 million, or $2.53 per diluted share.
SEMI Reports 13% Year-on-Year Growth in Global Silicon Wafer Shipments in Q1 2026
04/30/2026 | SEMIThe SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.