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Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
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Taiwanese PCB Industry Witnessed Steady Growth of 9.6% in Q3 2024
December 12, 2024 | TPCAEstimated reading time: Less than a minute
The global output value of Taiwanese circuit board enterprises demonstrated steady growth in the third quarter of 2024, reaching NT$227.1 billion, a year-over-year increase of 9.6%. This growth was primarily driven by the peak season effect, the mild recovery of mainstream terminal products, and the increasing demand for high-performance circuit boards in AI infrastructure and low-orbit satellite applications.
While the fourth quarter may face challenges due to slower-than-expected smartphone sales and global economic uncertainties, the overall output value for 2024 is still projected to reach NT$808.3 billion, a 5% year-over-year increase. The rising demand for AI edge devices and the alleviation of inflationary pressures are expected to drive further growth in the PCB industry in 2025.
In terms of product segments, multilayer boards, flexible boards, HDI boards, and IC substrates continue to be key drivers. The demand for high-performance circuit boards, particularly for AI and 5G applications, is expected to remain strong.
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Marcy’s Musings: Looking Forward—APEX EXPO 2026 (and AI Design Tools Too)
02/18/2026 | Marcy LaRont -- Column: Marcy's MusingsThis month, I-Connect007 Magazine takes you inside the show, from exhibitors and special events on the show floor to new insights from the technical conference, details on apprenticeships, keynotes, and advancements in critical industry standards. The show also has an international flavor, so we’ve included links to articles from Mexico, East Asia, and India about how they will be represented at APEX EXPO. It is a busy show that has a lot to offer attendees, and this issue will help ensure your time and attention are well spent.
Neways Begins Delivery of Saab’s UTAAS Integrated Sight and Fire Control Systems
02/11/2026 | NewaysNeways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, has started production and delivery of critical sub-systems for Saab’s UTAAS (Universal Tank and Anti-Aircraft System) integrated sight and fire control systems for BAE Systems’ CV90 infantry fighting vehicles.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026
02/10/2026 | TrendForceGoogle’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design.
Qnity Introduces First Ceria PCMP Clean for Advanced, Sustainable Semiconductor Manufacturing
02/09/2026 | QnityQnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced its first post-chemical mechanical planarization (PCMP) cleaning solution designed specifically for ceria applications.