-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
How Printed Circuit Boards Power Our Everyday Gadgets
December 12, 2024 | PRNewswireEstimated reading time: 2 minutes
According to the latest study from BCC Research, the demand for Printed Circuit Boards: Technologies and Global Markets was valued at $67.9 billion in 2023 and is projected to grow from $70.9 billion in 2024 to $92.4 billion by the end of 2029, at a compound annual growth rate (CAGR) of 5.4% from 2024 through 2029.
This report looks at current trends in the global printed circuit board (PCB) market, using data from 2023 and forecasts from 2024 to 2029. It breaks down revenue by market segments such as assembly technology and PCB type, and by region, including North America, Europe and Asia-Pacific.
It explores what's driving and challenging the market's growth, identifies leading PCB manufacturers, and reviews new technologies and competitive factors in the industry. Additionally, the report assesses the impact of environmental, social, and governance (ESG) issues on the PCB sector.
Some Interesting facts:
- Even after the pandemic ended, its effects were still being felt in 2023. The global PCB market suffered a significant decline due to factors like destocking and rising interest rates to curb inflation. The automotive and consumer electronics industries faced severe shortages of PCBs, which were in high demand because of 5G and the Internet of Things (IoT). This shortage led to higher prices, longer lead times, and stock-outs, affecting PCB manufacturers' production.
- China, the U.S., Taiwan, and South Korea are major PCB producers. In 2023, China produced 53.3% of the world's PCBs thanks to its large production capacity, cost-effective manufacturing, and strong supply chain.
- The trade conflict between the U.S. and China has significantly impacted the PCB market. U.S. imports from China dropped by 20.4% in 2023. As a result, the U.S. is shifting some PCB production to other regions, including Southeast Asia, with countries such as Vietnam and Taiwan becoming popular choices to avoid tariffs and diversify supply chains.
- Multilayer and high-density interconnection (HDI) are the most popular types of PCBs. They offer more design flexibility and higher circuit density, making them suitable for complex and compact electronics. They also provide better signal integrity, which is essential for high-speed communication in computer motherboards, smartphones, medical devices and aerospace electronics.
Factors contributing to this market's growth include:
- Growing use of autonomous and electric vehicles (AVs/EVs): More vehicles are being designed to drive themselves and run on electricity instead of gasoline. This shift is driven by the desire for safer, eco-friendly transportation and is transforming the automotive industry by introducing new technologies and reducing reliance on fossil fuels.
- Demand for consumer electronics and IoT devices: Consumer electronics and IoT devices are becoming increasingly central to modern lifestyles, homes and workplaces. More and more people want gadgets like smartphones, smartwatches and smart home products. These devices make life easier and more connected by allowing us to control and monitor various aspects of our lives through the internet.
- Rising adoption of 5G technology: More people and businesses are starting to use the latest mobile network, which is faster and more reliable than previous ones (4G and LTE). This improved connectivity supports faster internet speeds, better streaming, and the ability to connect many devices at once.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.