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Spotlight on PEDC: Filbert Arzola 

12/19/2024 | Andy Shaughnessy, Design007 Magazine
IPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.

STARTEAM GLOBAL Earns Silver EcoVadis Score

12/19/2024 | STARTEAM GLOBAL
STARTEAM GLOBAL is thrilled to announce they have earned a silver medal for their EcoVadis score this year — an incredible achievement!

Foxconn Honored with Seven TAISE Sustainability Awards

12/17/2024 | Hon Hai Technology Group
Hon Hai Technology Group (Foxconn), a global technology leader, has been recognized with seven prestigious awards from the Taiwan Sustainable Energy Research Foundation (TAISE) Sustainability Series. This recognition underscores the company’s commitment to environmental sustainability and social responsibility.

Scanfil Suzhou Factory Receives Sustainability Award from Thermo Fisher Scientific

12/16/2024 | Scanfil
Thermo Fisher Scientific granted a Sustainability Award to Scanfil’s Suzhou factory at the APAC Sustainability Summit. This accolade highlights Suzhou’s dedication to sustainable practices.

Compal Honored with Sustainability Awards

12/11/2024 | Compal Electronics Inc.
The 2024 17th TCSA Taiwan Corporate Sustainability Awards held its joint award ceremony today (11th). Compal was honored with two prestigious awards: the "Taiwan Top 100 Sustainability Model Enterprise Award" and the "Taiwan Sustainability Report – Platinum Award." Mr. Jack Wang, Vice President and Deputy Chief Sustainability Officer, represented the company to accept the honors.
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