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SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition

12/16/2024 | SCHMID Group
The SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.

OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space

12/12/2024 | BUSINESS WIRE
The OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.

Fresh PCB Concepts: PCB Plating Process Overview

12/12/2024 | Team NCAB -- Column: Fresh PCB Concepts
In this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.

Growth Unfolds: The First of STARTEAM’s Trio of Factories Set to Expand

12/05/2024 | STARTEAM GLOBAL
STARTEAM is thrilled to share news of our upcoming 3-step expansion at JST, with each step adding 50,000m² per month which began on May 27, 2024. This carefully planned extension is designed to significantly increase our production capacity and expand our talented team. Currently, our production space covers 30,000m². Through this expansion, we are setting our sights on incrementally increasing our capacity from 70,000m²/month to a remarkable 130,000m²/month.

Connect the Dots: Designing for Reality: Strip-Etch-Strip

12/05/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we focused on pattern plating. At this point, we are close to completing our boards and ready for the strip-etch-strip (SES) process. By this stage of the manufacturing process, we have laminated all the internal layers together, drilled the through-holes, applied the image to the external layers through photoresist, plated the copper in those channels to beef up the copper thickness for traces, pads, and through-holes, added a layer of electrolytic tin over the top of that copper to protect it during subsequent stages of production.
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