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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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SMTA: Pan Pacific Strategic Electronics Symposium Program Finalized
December 17, 2024 | SMTAEstimated reading time: Less than a minute
SMTA announced that the program is finalized for the 29th Annual Pan Pacific Strategic Electronics Symposium. The event will take place from January 27 to 30, 2025 at the Sheraton Maui Resort on Maui, Hawaii. The symposium strives to build bridges and nurture relationships across all boundaries; oceans and cultures, industries and technologies, companies and individuals with a mission of building the vision and future directions for the electronics industry.
On the afternoon of Monday, January 27, a plenary session will kick off the event followed by a keynote presentation by Boris Murmann, Ph.D., University of Hawaiʻi at Mānoa, titled “AI-Driven Agile Microelectronics.”
On Tuesday, January 28, Anaya Vardya, American Standard Circuits, will deliver the keynote lunch presentation on “Ultra High Density Interconnects (UHDI): A Global Innovation in Electronics Assembly.”
In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Thermal Performance, Microelectronics, Data & Academia, Restricted Temperatures, Technology Adoption, Artificial Intelligence, Harsh Environments, Advanced Packaging, Material Reliability and more.
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