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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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SMTA: Pan Pacific Strategic Electronics Symposium Program Finalized
December 17, 2024 | SMTAEstimated reading time: Less than a minute
SMTA announced that the program is finalized for the 29th Annual Pan Pacific Strategic Electronics Symposium. The event will take place from January 27 to 30, 2025 at the Sheraton Maui Resort on Maui, Hawaii. The symposium strives to build bridges and nurture relationships across all boundaries; oceans and cultures, industries and technologies, companies and individuals with a mission of building the vision and future directions for the electronics industry.
On the afternoon of Monday, January 27, a plenary session will kick off the event followed by a keynote presentation by Boris Murmann, Ph.D., University of Hawaiʻi at Mānoa, titled “AI-Driven Agile Microelectronics.”
On Tuesday, January 28, Anaya Vardya, American Standard Circuits, will deliver the keynote lunch presentation on “Ultra High Density Interconnects (UHDI): A Global Innovation in Electronics Assembly.”
In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Thermal Performance, Microelectronics, Data & Academia, Restricted Temperatures, Technology Adoption, Artificial Intelligence, Harsh Environments, Advanced Packaging, Material Reliability and more.
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