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IPC Releases Latest List of Standards and Revisions
December 17, 2024 | IPC Community Editorial TeamEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC-2294
Design Standard for Printed Electronics on Rigid Substrates
IPC-2294 establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to the IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive, or nonconductive.
IPC-6904
Qualification and Performance Specification for Printed Electronics on Rigid Substrates
IPC-6904 establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive, or nonconductive.
IPC/Hermes-9852-v1.6
The Global Standards for Machine-to-Machine Communication in SMT Assembly
IPC-Hermes-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-Hermes-9852 can assist any electronics manufacturer, large or small, to align their companies with Smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities for Hermes-enabled equipment to be queried on its Hermes capabilities.
To see the rest of the standards released for Q4, which were featured in the Fall 2024 issue of IPC Community, click here.
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