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Getters, Thermal Management, and High-Reliability Packaging: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

06/10/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several technologies shaping the future of advanced packaging, from maintaining stable environments inside hermetic packages to managing heat in increasingly complex 3D architectures. The issue also examines packaging innovations for aerospace, defense, and automotive applications, as well as broader connections between semiconductor interconnects and the systems they support.

RTX's Collins Aerospace Quadruples MRO Footprint in Malaysia

06/09/2026 | RTX
Collins Aerospace, an RTX business, has expanded its maintenance, repair and overhaul (MRO) facility at Subang Aerotech Park in Malaysia.

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

06/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications:

GreenSource Fabrication to Showcase Advanced PCB Manufacturing Capabilities at IMS 2026

06/05/2026 | GreenSource Fabrication
GreenSource Fabrication today announced that it will exhibit at IMS 2026, the IEEE International Microwave Symposium (IMS), taking place June 7–13, 2026, at the Thomas M. Menino Convention and Exhibition Center in Boston, Massachusetts.

Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4

06/04/2026 | Anaya Vardya, American Standard Circuits
Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?
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