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Advanced Electronics Packaging Digest

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JIATF-401 Selects Directed-Energy Systems for Counter-Drone Pilot Program

10/06/2026 | U.S. Department of War
The Department of War announced the directed-energy systems selected following the Joint Interagency Task Force 401's (JIATF-401) counter-unmanned aircraft systems (UAS) directed energy pilot program, marking the next phase of efforts to expand the operational use of high-energy laser (HEL) and high-powered microwave (HPM) capabilities across the homeland.

Ensurge Micropower Relocates to New San Jose Facility to Advance Solid-State Microbattery Development

09/09/2026 | Globe Newswire
Ensurge Micropower ASA, a pioneer in solid-state lithium microbatteries, announced it is relocating its San Jose operations to a new facility at 130 Baytech Drive.

CIMS to Showcase Advanced PCB Solutions at KPCA Show 2026

08/27/2026 | CIMS
CIMS invites visitors to KPCA Show 2026, taking place September 9-11 at Songdo Convensia in Incheon, South Korea.

The Relevance of VeCS as an HDI Process Option

08/20/2026 | Marcy LaRont, I-Connect007
Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.

CEA-Leti, GlobalFoundries Advance European FD-SOI Innovation via FAMES Pilot Line

06/11/2026 | CEA-Leti
CEA‑Leti, a leading European research institute for microelectronics, reaffirmed its long‑standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two decades of joint work on fully depleted silicon‑on‑insulator (FD‑SOI) technology and reinforcing Europe's leadership in energy‑efficient, sovereign semiconductors.
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