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Cutting-Edge Satellite Tracks Lake Water Levels in Ohio River Basin

12/30/2024 | NASA
Data from the U.S.-European Surface Water and Ocean Topography mission gives researchers a detailed look at lakes and reservoirs in a U.S. watershed.

UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2

12/23/2024 | Anaya Vardya, American Standard Circuits
​​​​​​​Ultra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.

Indium Technical Expert to Present at SiP Conference China

11/25/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.

Offshore Sourcing in the Global Supply Chain

11/20/2024 | Brittany Martin, I-Connect007
​​​​​​​Bob Duke, president of the Global Sourcing Division at American Standard Circuits, discusses the challenges and benefits of navigating the global supply chain, including the value of strong supplier relationships, rigorous quality control, and strategic sourcing from regions including China, Vietnam, and India.

Advanced Packaging: Preparation is Now

11/20/2024 | Nolan Johnson, SMT007 Magazine
A new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
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