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UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2
December 23, 2024 | Anaya Vardya, American Standard CircuitsEstimated reading time: Less than a minute
Ultra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing:
Smart Manufacturing and IoT-Driven Automation
UHDI enables the miniaturization and performance enhancement of IoT sensors, which are the backbone of Smart manufacturing. With this level of automation, UHDI aids in integrating advanced security measures within IoT devices to prevent data breaches.
- Compact IoT sensors and modules: For real-time data acquisition and machine monitoring
- High-density connectivity: For edge computing devices that process data locally in smart systems
- Energy-efficient controllers: For powering distributed sensor networks
- Multi-sensor integration: UHDI allows multiple sensors (e.g., temperature, pressure, vibration) to be packed into a single compact unit
- Real-time data processing: Dense circuitry ensures high-speed data acquisition and transmission
- Durability: Reliable connections for sensors operating in harsh factory environments
- Hardware-based encryption modules: Ensuring secure data transmission
- Compact circuits for secure booting: Protecting devices from unauthorized access
To read this entire article, which appeared in the December 2024 issue of Design007 Magazine, click here.
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12/20/2024 | Nolan Johnson, I-Connect007Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Indium Technical Expert to Present at SiP Conference China
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Offshore Sourcing in the Global Supply Chain
11/20/2024 | Brittany Martin, I-Connect007Bob Duke, president of the Global Sourcing Division at American Standard Circuits, discusses the challenges and benefits of navigating the global supply chain, including the value of strong supplier relationships, rigorous quality control, and strategic sourcing from regions including China, Vietnam, and India.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Kimball Electronics 2024 Annual Report: Strategically Focused
10/03/2024 | Kimball ElectronicsKimball Electronics releases its 2024 Annual Report, Strategically Focused, highlighting a year of innovation, hard work and commitment to excellence. From groundbreaking projects to sustainable practices, our journey this year has been nothing short of remarkable.