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ViTrox Welcomes Gemaddis as a New Sales Channel Partner in France
December 20, 2024 | ViTroxEstimated reading time: 1 minute
ViTrox Technologies, which aims to be the World’s Most Trusted Technology Company in delivering innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronics manufacturing industries, is honoured to announce its partnership with Gemaddis as its new Sales Channel Partner (SCP) for the French market, effective May 2024.
This strategic collaboration marks another milestone in ViTrox’s commitment to expanding its footprint in the European market. As an authorised distributor, Gemaddis will offer ViTrox’s cutting-edge solutions across France, including the Advanced 3D Solder Paste Inspection (SPI) Solution, Advanced 3D Optical Inspection (AOI) Solution, Advanced 3D X-Ray Inspection (AXI) Solution, Advanced Robotic Vision (ARV) Solution, and Industry 4.0 Manufacturing Intelligence Solutions (V-ONE).
Gemaddis, a French company headquartered in Annecy, Haute-Savoie, was formed through the merger of GEMIDO and Addis Electronic. The company specialises in three key areas: the distribution of machines for the electronics industry, the design of solutions for electronics manufacturing, particularly for printed circuit assembly and process characterisation/ optimisation.
“Gemaddis is a well-established company with over 20 years of experience and substantial resources to support the regions they serve. Their expertise and strong market presence make them an excellent partner for ViTrox as we continue to expand our footprint in the European market,” said Mr Seow Zi Yang, Director of Business Development & Technical Support.
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UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
10/27/2025 | I-Connect007 Editorial TeamNvidia has begun production of its next-generation Blackwell GPUs in the United States, but the company still depends heavily on Taiwan to complete the process, The Register reported.
TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
10/27/2025 | I-Connect007 Editorial TeamTSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.
YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications
10/24/2025 | BUSINESS WIREYield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, announced that it has received multiple tool orders from a global leader in AI infrastructure solutions.