SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana
December 20, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.
“The CHIPS incentives announced today will help strengthen U.S.-based R&D and advanced packaging for artificial intelligence products, filling a key gap in America’s semiconductor supply chain and strengthening U.S. technology leadership. We applaud SK Hynix for investing ambitiously in these projects, which will also create jobs and economic growth in Indiana, and we commend the U.S. Commerce Department for working to finalize these critical CHIPS investments.”
The CHIPS Act is on track to strengthen American manufacturing, create jobs, boost economic growth, and promote national security. The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032.
The U.S. Department of Commerce previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
Intel Shares Surge Following Report of Early Talks to Make Chips for Rival AMD
10/03/2025 | I-Connect007 Editorial TeamIntel shares jumped on October 1, following reports that the company is in early talks to manufacture chips for rival AMD through its foundry business, according to CNBC.
Technica Hosts In-House Visit from PCBAA
10/01/2025 | Technica USADavid Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A.
European Semiconductor Industry Endorses Semicon Coalition's Call for Revised EU Chips Act - Cloned
09/30/2025 | SEMISEMI Europe, along with over 75 semiconductor and microelectronics companies, research and technology organizations (RTOs) and trade associations, officially endorse the Declaration of the Semicon Coalition.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.